L
SMD Wraparound Ultra Low Value
Thin Film Resistors
Vishay Sfernice
PACKAGING
PACKAGING RULES
Several types of packaging are proposed: waffle-pack and
tape and reel
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the top
of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please concult Vishay/Sfernice for specific ordering
code
NUMBER OF PIECES PER PACKAGE
TAPE
SIZE MOQ
TAPE AND REEL
WAFFLE PACK
WIDTH
2" × 2"
MIN.
MAX.
4000
2000
0402
0603
0805
100
8 mm
0705
Tape and Reel
100
100
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
1206
1505
2010
140
60
8 mm (1)
Note
(1) 12 mm on request
•
Size 2512 under development
PERFORMANCE
VALUES AND DRIFT
TESTS
CONDITIONS
MIL-R-55342
TYPICAL
REQUIREMENTS
PERFORMANCES
MIL-R-55342 C
MIL-STD-702-Method 107
Thermal shock
0.25 %
0.10 %
0.25 %
0.25 %
0.02 %
0.01 %
0.01 %
0.04 %
MIL-R-55342 C
PARA 3.10.4.7.5
Short time overload
MIL-R-55342 C
PARA 3.9 and 4.7.4
Low temperature operation
Resistance to solder heat
MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202-Method 106
Moisture resistance
High temperature
Load life
0.40 %
0.20 %
0.50 %
0.01 %
0.075 %
0.15 %
MIL-R-55342 C
PARA 3.11 and 4.7.6
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202-Method 108
Document Number: 53018
Revision: 29-Oct-09
For technical questions, contact: sfer@vishay.com
www.vishay.com
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