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L0805H9R76GNT PDF预览

L0805H9R76GNT

更新时间: 2024-02-24 14:33:22
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
5页 136K
描述
RESISTOR, THIN FILM, 0.2 W, 2 %, 50 ppm, 9.76 ohm, SURFACE MOUNT, 0805, CHIP, GREEN

L0805H9R76GNT 数据手册

 浏览型号L0805H9R76GNT的Datasheet PDF文件第1页浏览型号L0805H9R76GNT的Datasheet PDF文件第2页浏览型号L0805H9R76GNT的Datasheet PDF文件第4页浏览型号L0805H9R76GNT的Datasheet PDF文件第5页 
L
SMD Wraparound Ultra Low Value  
Thin Film Resistors  
Vishay Sfernice  
PACKAGING  
PACKAGING RULES  
Several types of packaging are proposed: waffle-pack and  
tape and reel  
Waffle Pack  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered exceeds maximum quantity of a  
single waffle pack, the waffle packs are stacked up on the top  
of each other and closed by one single cover.  
To get “not stacked up” waffle pack in case of ordered  
quantity > maximum number of pieces per package:  
Please concult Vishay/Sfernice for specific ordering  
code  
NUMBER OF PIECES PER PACKAGE  
TAPE  
SIZE MOQ  
TAPE AND REEL  
WAFFLE PACK  
WIDTH  
2" × 2"  
MIN.  
MAX.  
4000  
2000  
0402  
0603  
0805  
100  
8 mm  
0705  
Tape and Reel  
100  
100  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered is between the MOQ and the  
maximum reel capacity, only one reel is provided.  
When several reels are needed for ordered quantity  
within MOQ and maximum reel capacity: Please consult  
Vishay Sfernice for specific ordering code  
1206  
1505  
2010  
140  
60  
8 mm (1)  
Note  
(1) 12 mm on request  
Size 2512 under development  
PERFORMANCE  
VALUES AND DRIFT  
TESTS  
CONDITIONS  
MIL-R-55342  
TYPICAL  
REQUIREMENTS  
PERFORMANCES  
MIL-R-55342 C  
MIL-STD-702-Method 107  
Thermal shock  
0.25 %  
0.10 %  
0.25 %  
0.25 %  
0.02 %  
0.01 %  
0.01 %  
0.04 %  
MIL-R-55342 C  
PARA 3.10.4.7.5  
Short time overload  
MIL-R-55342 C  
PARA 3.9 and 4.7.4  
Low temperature operation  
Resistance to solder heat  
MIL-R-55342 C  
PARA 3.12, 4.7.7, 4.7.1.2  
MIL-R-55342 C  
PARA 3.13 and 4.7.8  
MIL-STD-202-Method 106  
Moisture resistance  
High temperature  
Load life  
0.40 %  
0.20 %  
0.50 %  
0.01 %  
0.075 %  
0.15 %  
MIL-R-55342 C  
PARA 3.11 and 4.7.6  
MIL-R-55342 C  
2000 h Pn at 70 °C  
MIL-STD-202-Method 108  
Document Number: 53018  
Revision: 29-Oct-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
59  

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