Datasheet > L0805H9R76GNT

L0805H9R76GNT

更新时间： 2024-02-10 06:48:12

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
5页	136K
描述
RESISTOR, THIN FILM, 0.2 W, 2 %, 50 ppm, 9.76 ohm, SURFACE MOUNT, 0805, CHIP, GREEN

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L0805H9R76GNT 数据手册

SMD Wraparound Ultra Low Value

Thin Film Resistors

Vishay Sfernice

SUGGESTED LAND PATTERN (to IPC-7351A)

G_min.

X_max.

Z_max.

DIMENSIONS (in millimeter)

CHIP SIZE

Z_max.

2.37

2.76

3.91

4.66

5.93

G_min.

0.35

0.74

1.85

2.44

3.71

X_max.

0.98

1.40

1.73

1.45

2.67

0603

0705/0805

1206

1505

2010

Note

Size 2512 under development

•

Option: Enlarged Terminations

For stringent and special power dissipation requirements,

the thermal resistance between the resistive layer and

the solder joint can be reduced using enlarged terminations

chip resistors which are soldered on large and thick

copper pads acting as heat sinks (see application note:

“Power Dissipation in High Precision Vishay Sfernice Chip

Resistors and Arrays (P Thin Film, PRA Arrays, CHP Thick

Film)”: www.vishay.com/doc?53048).

For enlarged terminations: Please consult Vishay Sfernice.

ELECTRICAL SPECIFICATIONS

POWER DERATING CURVE

Resistance range:

Resistance tolerance:

Power dissipation:

0.1 Ω to 9.99 Ω

1 % to 10 %

0.125 mW to 1 W at + 70 °C

100

Temperature coefficient: Down to 100 ppm/°C

CLIMATIC SPECIFICATIONS

Operating temp. range:

- 55 °C to + 155 °C

MECHANICAL SPECIFICATIONS

Substrate:

Alumina

60 70 80

100

120

140 155

Resistive layer:

Coating:

NiCr + Ta₂O₅

Silicone

Ambient Temperature in °C

Terminations:

Solderable

TOLERANCE AND TCR VS. OHMIC VALUE

B type: SnPb over nickel barrier

N type: SnAg over nickel barrier

G type: Gold over nickel barrier

TIGHTEST

VALUE

RANGE

BEST TCR

(ppm/°C)

TOLERANCE

(%)

TERMINATIONS

0R1 < 0R25

0R25 < 0R5

0R5 < 9R99

0R1 < 0R5

0R5 < 9R99

300

200

100

300

200

N or B

www.vishay.com

For technical questions, contact: sfer@vishay.com

Document Number: 53018

Revision: 29-Oct-09

123 4 5

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