Datasheet > L-T670WDT-NW5-P

L-T670WDT-NW5-P

更新时间： 2022-02-26 14:55:06

品牌	Logo	应用领域
台湾光鼎 - PARALIGHT		/
页数	文件大小	规格书
17页	358K
描述
SURFACE MOUNT DEVICE LED

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

L-T670WDT-NW5-P 数据手册

Release by

PARALIGHT DCC

SURFACE MOUNT DEVICE LED

Part No. : LT670WDT-NW5-P

REV: A / 0

l CAUTIONS

1. Static Electricity:

* Static electricity or surge voltage damages the LEDs.

It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.

* All devices, equipment and machinery must be properly grounded.

It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.

* When inspecting the final products in which LEDs were assembled, it is recommended to check

whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged

LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).

* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,

the forward voltage becomes lower, or the LEDs do not light at the low current.

Criteria: (VF>2.0V,at IF=0.5m A )

2. Storage :

* Before opening the package :

The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture

proof packaging with absorbent material (silica gel) is recommended.

* After opening the package :

The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within

168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in

moisture proof packages, such as sealed containers with packages of moisture absorbent material

(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to

reseal the moisture proof bag again.

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should e performed using the following conditions.

Baking treatment: more than 24hours at 65±5℃.

* Please avoid rapid transitions in ambient temperature in high humidity environments where

condensation may occur.

3. Soldering:

Do not apply any stress to the LED lens during soldering while the LED is at high temperature.

Recommended soldering condition.

* Reflow Soldering :

Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.

* Soldering Iron : (Not recommended)

Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :

20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.

DRAWING NO. : DS-7A-11-0017

DATE : 2011-11-23

PAGE

14 of 17

PARA-FOR-068

1...11 12 131415 16 17

中文翻译

下载PDF

与L-T670WDT-NW5-P相关器件

型号	品牌	获取价格	描述	数据表
LT670WDT-WW1	PARALIGHT	获取价格	SURFACE MOUNT DEVICE LED
L-T670WDT-WW1-R	PARALIGHT	获取价格	SURFACE MOUNT DEVICE LED
LT670Z	SEOUL	获取价格	GREEN OVAL LAMP LED
LT671	SEOUL	获取价格	INFRARED LAMP LED
LT6710	SHARP	获取价格	Solid State Lamp (LED Lamp Cluster)
LT6725	SHARP	获取价格	Dual Color LED Display Cluster, Super Luminosity Red/yellow Green, 52mm,
LT6750	SHARP	获取价格	Dual Color LED Display Cluster, Super Luminosity Red/yellow Green, 52mm,
LT680Z	SEOUL	获取价格	GREEN OVAL LAMP LED
LT681	SEOUL	获取价格	INFRARED LAMP LED
LT685	Linear	获取价格	High Speed Comparator

与L-T670WDT-NW5-P相关文章

压敏电阻器在直流电路中的过压保护应用探讨
2024-06-07

10
电感耐压值及其与电感大小的关系
2024-06-07

15
CNY17F光耦合器：特性、应用、封装、引脚功能及替换型号解析
2024-06-07

17
DS1307资料解析：特性、引脚说明、替代推荐
2024-06-07

10

产品中心

服务支持

精选活动

关于我们

帮助中心

L-T670WDT-NW5-P

L-T670WDT-NW5-P 数据手册

与L-T670WDT-NW5-P相关器件

与L-T670WDT-NW5-P相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

L-T670WDT-NW5-P

L-T670WDT-NW5-P 数据手册

与L-T670WDT-NW5-P相关器件

与L-T670WDT-NW5-P相关文章

您还可以找

您在本页遇到什么问题？