Datasheet > L-C170JYCT

L-C170JYCT

更新时间： 2022-02-26 14:41:49

品牌	Logo	应用领域
台湾光鼎 - PARALIGHT		/
页数	文件大小	规格书
14页	301K
描述
SURFACE MOUNT DEVICE LED

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L-C170JYCT 数据手册

Release by

PARALIGHT DCC

SURFACE MOUNT DEVICE LED

Part No. : L-C170JYCT

REV:B / 1

Wave soldering :

Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.

preformed consecutively cooling process is required between 1^stand 2^ndsoldering processes.

4. Lead-Free Soldering

For Reflow Soldering :

、

℃

1 Pre-Heat Temp:150-180 ,120sec.Max.

、

℃

2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.

、

℃，

3 Peak Temperature:260

5sec.

、

4 Reflow Repetition:2 Times Max.

、

5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu

For Soldering Iron (Not Recommended) :

、

℃

1 Iron Tip Temp:350 Max.

、

2 Soldering Iron:30w Max.

、

3 Soldering Time:3 Sec. Max. One Time.

For Dip Soldering :

、

℃

1 Pre-Heat Temp:150 Max. 120 Sec. Max.

、

℃

2 Bath Temp:265 Max.

3、Dip Time:5 Sec. Max.

5. Drive Method

Circuit model A

Circuit model B

(A)Recommended circuit.

(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.

DRAWING NO. : DS-72-06-0007

DATE : 2009-12-09

PAGE 13 of 14

PARA-FOR-068

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