Datasheet > KP80526NY700128/SL53D

KP80526NY700128/SL53D

更新时间： 2024-01-06 03:10:42

品牌	Logo	应用领域
英特尔 - INTEL		外围集成电路
页数	文件大小	规格书
2页	178K
描述
RISC Microprocessor, 32-Bit, 700MHz, CMOS, PPGA495

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KP80526NY700128/SL53D 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	SPGA, PGA495,21X24,50	Reach Compliance Code：	unknown
风险等级：	5.92	位大小：	32
JESD-30 代码：	R-PPGA-P495	端子数量：	495
封装主体材料：	PLASTIC/EPOXY	封装代码：	SPGA
封装等效代码：	PGA495,21X24,50	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, SHRINK PITCH	电源：	1.5,1.6 V
认证状态：	Not Qualified	速度：	700 MHz
子类别：	Microprocessors	表面贴装：	NO
技术：	CMOS	端子形式：	PIN/PEG
端子节距：	1.27 mm	端子位置：	PERPENDICULAR
uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC	Base Number Matches：	1

KP80526NY700128/SL53D 数据手册

浏览型号KP80526NY700128/SL53D的Datasheet PDF文件第2页

product brief

Intel^®Celeron^®Processor - Low

Power for Applied Computing

Product Highlights

300 MHz and 400 MHz:

Built on the Intel 0.18 micron process

128K Full speed on-die L2 cache operating

at core frequency

Low profile, surface mount BGA package

BGA (31 x 27 x 2.5mm), (BGA2)

495 leads in area array

Tcase: 0 to 100C

650 MHz:

Ultra-Low Voltage 650 MHz

Built on the Intel 0.13 micron process

650 MHz processor speed

256K Full speed on-die L2 cache operating at

core frequency

100 MHz processor side bus

Low profile, surface mount µFCBGA package

8.3W TDP (max), 7.0W TDP (typ)

µFCBGA package (35 x 35 mm)

Supported with Intel 440MX and Intel 815E

chipsets

479 balls in area array

Tcase: 0 to 100C

Product Overview

Functional features

MMX technology

The Intel^®Celeron^®processors - Low Power,

Ultra Low Power and Ultra Low Voltage now

Floating Point Unit (FPU)

Dynamic Execution Micro-Architecture

provide an exceptional value for thermally

sensitive and space constrained applied

computing applications by combining the

optimal balance of cost, performance, and low

power. Available in the small form factor BGA

package at 300 and 400 MHz with 128K of

on-die L2 cache or the µFCBGA package at

650 MHz with 256K of on-die L2 cache. These

features make it ideal for value-based, low-

profile, low-power applied computing

applications, such as data communications,

telecommunications, industrial automation and

transaction terminals.

The 300 MHz processor, at just 1.1V and 5.7

W TDP (max), and the 650 MHz processor,

also at 1.1V and with a 8.3W TDP (max), are

ideal solutions for communication appliances

such as set-top boxes, network attached

storage, web pads and other applications with

lower power envelopes and BOM

On-Die L2 Cache with Error Checking and

Correcting (ECC)

Low Power 400 MHz

400 MHz processor speed

100 MHz processor side bus

10.1W TDP (max). 6.5 W TDP (typ)

Supported with the Intel 815, Intel 815E,

Intel^®440BX AGPset and Intel^®440MX

Chipsets

Ultra-Low Power 300 MHz

300 MHz processor speed

100 MHz processor side bus

5.7W TDP (max), 4.2 W TDP (typ)

Supported with the Intel 815, Intel 815E, and the

Intel 440MX Chipsets

requirements.

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