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KP80526GY850256SL53L PDF预览

KP80526GY850256SL53L

更新时间: 2024-02-02 10:48:08
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
86页 537K
描述
RISC Microprocessor, 32-Bit, 850MHz, CMOS, PPGA486

KP80526GY850256SL53L 数据手册

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Mobile Intel® Pentium® III Processor in BGA2 and Micro-PGA2 Packages  
at 850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-voltage 600 MHz,  
and Ultra Low-voltage 500 MHz  
Tables  
Table 1. New Mobile Pentium III Processor Signals .................................................... 11  
Table 2. Removed Mobile Pentium II Processor Signals.............................................. 12  
Table 3. Clock State Characteristics .......................................................................... 15  
Table 4. Mobile Pentium III Processor CPUID ............................................................ 16  
Table 5. Mobile Pentium III Processor CPUID Cache and TLB Descriptors................... 17  
Table 6. System Signal Groups ................................................................................. 18  
Table 7. Recommended Resistors for Mobile Pentium III Processor Signals................. 19  
Table 8. Mobile Pentium III Processor Absolute Maximum Ratings .............................. 24  
Table 9. Mobile Pentium III Processor Power Specifications1....................................... 25  
Table 10. GTL+ Signal Group DC Specifications ........................................................ 26  
Table 11. GTL+ Bus DC Specifications ...................................................................... 26  
Table 12. Clock, APIC, TAP, CMOS, and Open-drain Signal Group DC Specifications.. 27  
Table 13. System Bus Clock AC Specifications1 ......................................................... 29  
Table 14. Valid Mobile Pentium III Processor Frequencies........................................... 29  
Table 15. GTL+ Signal Groups AC Specifications1...................................................... 30  
Table 16. CMOS and Open-drain Signal Groups AC Specifications1, 2.......................... 30  
Table 17. Reset Configuration AC Specifications ........................................................ 31  
Table 18. APIC Bus Signal AC Specifications1............................................................ 31  
Table 19. TAP Signal AC Specifications1.................................................................... 32  
Table 20. Quick Start/Deep Sleep AC Specifications1 ................................................. 33  
Table 21. Stop Grant/Sleep/Deep Sleep AC Specifications.......................................... 33  
Table 22. Intel SpeedStep Technology AC Specifications............................................ 33  
Table 23. BCLK Signal Quality Specifications............................................................. 41  
Table 24. PICCLK Signal Quality Specifications ......................................................... 41  
Table 25. GTL+ Signal Group Ringback Specification ................................................. 43  
Table 26. GTL+ Signal Group Overshoot/Undershoot Tolerance at the Processor Core1, 4,  
5 ............................................................................................................... 44  
Table 27. Non-GTL+ Signal Group Overshoot/Undershoot Tolerance at the Processor  
Core 1, 4, 5.................................................................................................. 46  
Table 28. Surface-mount BGA2 Package Specifications ............................................. 47  
Table 29. Socketable Micro-PGA2 Package Specification ........................................... 50  
Table 30. Signal Listing in Order by Pin/Ball Number .................................................. 54  
Table 31. Signal Listing in Order by Signal Name ....................................................... 58  
Table 32. Voltage and No-Connect Pin/Ball Locations................................................. 60  
Table 33. Power Specifications for Mobile Pentium III Processor with Intel SpeedStep  
Technology ............................................................................................... 62  
Table 34. Thermal Diode Interface............................................................................. 63  
Table 35. Thermal Diode Specifications ..................................................................... 63  
Table 36. BSEL[1:0] Encoding................................................................................... 68  
Table 37. Voltage Identification Encoding................................................................... 76  
Table 38. Input Signals ............................................................................................. 77  
Table 39. Output Signals........................................................................................... 78  
Table 40. Input/Output Signals (Single Driver) ............................................................ 78  
Table 41. Input/Output Signals (Multiple Driver).......................................................... 78  
Table 42. PLL Filter Inductor Recommendations......................................................... 81  
Table 43. PLL Filter Capacitor Recommendations ...................................................... 82  
Table 44. PLL Filter Resistor Recommendations ........................................................ 82  
4
Datasheet  
249409-001  

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