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KMP500E476M762ET00 PDF预览

KMP500E476M762ET00

更新时间: 2022-12-19 10:07:24
品牌 Logo 应用领域
贵弥功 - CHEMI-CON 电容器陶瓷电容器
页数 文件大小 规格书
4页 79K
描述
METAL CAP TYPE MULTILAYER CERAMIC CAPACITORS

KMP500E476M762ET00 数据手册

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METAL CAP TYPE MULTILAYER CERAMIC CAPACITORS  
/
?SPECIFICATIONS  
No.  
6
Items  
Specification  
Test Condition  
Temperature Cycle  
Appearance : No visible damage.  
DC/C : P15%  
Step  
Temperature (C)  
Min. Category temperature P3  
Room temperature  
(min.)  
30P3  
1
D.F. : To meet the initial specification.  
I.R. : To meet the initial specification.  
Withstand voltage : No abnormality.  
2
3 max.  
30P3  
3
4
Max. Category temperature P2  
Room temperature  
3 max.  
<Cycle>  
THP series : 100 cycles  
TMP series : 500 cycles  
Humidity Load Life  
Appearance : No abnormality.  
DC/C : P20%  
Temperature : 40P2C  
7
8
Humidity  
Voltage  
Time  
: 90 to 95%RH  
: Rated voltage  
: 500P204hours  
D.F. : 7% max.  
I.R. : 50/CR(MO) or 1000(MO)  
whichever is less.  
Withstand voltage : No abnormality.  
Temperature : 85P2C  
Endurance  
Appearance : No abnormality.  
DC/C : P20%  
Voltage  
Time  
: 200% of rated voltage.  
: 1000P408hours  
D.F. : 7% max.  
I.R. : 100/CR(MO) or 1000(MO)  
Temperature : 125P3C  
whichever is less.  
Voltage  
Time  
: Rated voltage  
: 1000P408hours  
Withstand voltage : No abnormality.  
*CR  
: Rated Capacitance(MF)  
?Note of mountig for THP series.  
1. The face of wider gap between a capacitor and a substrate shall be the mounting face.  
2. To prevent degredation of heat cycling capability, if need to be careful about amount of solder that would not go into  
the inner side of terminations.  
Substrate  
Gap  
(2/4)  
CAT. No. E1002I  

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