DRAM MODULE
KMM5364003BSW/BSWG
KMM5364003BSW/BSWG Fast Page Mode
4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V
GENERAL DESCRIPTION
FEATURES
The Samsung KMM5364003B is a 4Mx36bits Dynamic RAM
high density memory module. The Samsung KMM5364003B
consists of two CMOS 4Mx16bits and one CMOS Quad CAS
4Mx4bits DRAMs in TSOP packages mounted on a 72-pin
glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor
is mounted on the printed circuit board for each DRAM. The
KMM5364003B is a Single In-line Memory Module with edge
connections and is intended for mounting into 72 pin edge
connector sockets.
• Part Identification
- KMM5364003BSW(4K cycles/64ms Ref, TSOP, Solder)
- KMM5364003BSWG(4K cycles/64ms Ref, TSOP, Gold)
• Fast Page Mode Operation
• CAS-before-RAS & Hidden Refresh capability
• RAS-only refresh capability
• TTL compatible inputs and outputs
• Single +5V±10% power supply
• JEDEC standard PDpin & pinout
PERFORMANCE RANGE
• PCB : Height(1000mil), single sided component
Speed
-5
tRAC
50ns
60ns
tCAC
13ns
15ns
tRC
tPC
90ns
110ns
35ns
40ns
-6
PIN CONFIGURATIONS
PIN NAMES
Pin
Symbol
Pin
Symbol
Pin Name
A0 - A11
DQ0 - 35
Function
Address Inputs
Data In/Out
1
2
3
4
5
6
7
8
VSS
DQ0
DQ18
DQ1
DQ19
DQ2
DQ20
DQ3
DQ21
Vcc
NC
A0
A1
A2
A3
A4
A5
A6
A10
DQ4
DQ22
DQ5
DQ23
DQ6
DQ24
DQ7
DQ25
A7
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
DQ17
DQ35
Vss
CAS0
CAS2
CAS3
CAS1
RAS0
NC
W
Read/Write Enable
Row Address Strobe
Column Address Strobe
Presence Detect
Power(+5V)
RAS0, RAS2
CAS0 - CAS3
PD1 -PD4
Vcc
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
NC
W
NC
DQ9
DQ27
DQ10
DQ28
DQ11
DQ29
DQ12
DQ30
DQ13
DQ31
Vcc
DQ32
DQ14
DQ33
DQ15
DQ34
DQ16
NC
Vss
Ground
NC
No Connection
PRESENCE DETECT PINS (Optional)
Pin
50NS
60NS
PD1
PD2
PD3
PD4
Vss
NC
Vss
NC
NC
NC
Vss
Vss
A11
Vcc
A8
A9
NC
RAS2
DQ26
DQ8
PD1
PD2
PD3
PD4
NC
Vss
SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.