Reference only
Caution
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,
etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Apparatus
Hand Separation
Nipper Separation
Board Separation Method
(1) Board Separation Jig
(2) Disk Separator
(3) Router Type Separator
Level of stress on board
Recommended
High
×
Medium
Medium
Low
△*
△*
○
· Board handling
Hand and nipper separation
apply a high level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Layout of slits
Notes
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
* When a board separation jig or disk separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors
may crack. Use router type separator if at all possible.
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows. Recommended example: Stress on the component
mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards
the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the
capacitors increases due to large stress being applied to the component mounting position, if the portion away
from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
Recommended
Not Recommended
[Outline of Jig]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
① Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement
the following measures. (Refer to item 1. Mounting Position)
② Mount the components at a right angle to the board separation surface.
③ When mounting components near the board separation point, add slits in the separation position
near the component.
④ Keep the mounting position of the components away from the board separation point.
(2) Example of a Disk Separator
An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom
blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board
deflection stress will be applied and cause cracks in the capacitors.
① When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right
or front-rear directions
② The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of
the V groove with consideration about strength of material of the printed circuit board.
[Outline of Machine]
[Principle of Operation]
[Cross-section Diagram]
6 / 22
EGKRC01
5秒后页面跳转
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