Datasheet > KCM55LR7YA156KH01#

KCM55LR7YA156KH01#

更新时间： 2023-09-03 20:26:50

品牌	Logo	应用领域
村田 - MURATA		医疗医疗器械
页数	文件大小	规格书
23页	1296K
描述
汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C]

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Reference only

Caution

■Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

[Component Direction]

Locate chip horizontal to the direction in which stress acts.

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all

of the following three measures; however, implement as many measures as possible to reduce stress.

Contents of Measures

(1) Turn the mounting direction of the component parallel

(1) to the board separation surface.

Stress Level

A>D

Perforation

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

(3) from the board separation surface.

A>B

Slit

A>C

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

Screw Hole Recommended

2. Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

8. We have also produced a DVD which shows a summary of our opinions, regarding the precautions for mounting.

Please contact our sales representative to request the DVD.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum

to prevent them from any bending damage or cracking. Please take into account the following precautions and

recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

3 / 22

EGKRC01

1 2 345 6 7...23

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