Reference only
Notice
■Rating
1. Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with
a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider
the temperature distribution in equipment and the seasonal temperature variable factor.
1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper
operating temperature or less when including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific
frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor,
noise may occur.
■Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly
on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is
different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between
the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and
contraction. When small size capacitors of 1005 size or less are mounted on a single-layered glass epoxy board,
it will also cause cracking of the chip for the same reason.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder(ground)
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing
of Chip Components
and Leaded Components
Soldering Iron
Lead Wire
Solder Resist
Placing
of Leaded Components
after Chip Component
Solder Resist
Lateral Mounting
9/19
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