Reference only
AEC-Q200
Test Item
No.
17
Specifications
No marking defects
AEC-Q200 Test Method
Board Flex
Appearance
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig1 using solder. Then apply a force in the
Capacitance
Change
Within ±5.0%
direction shown in Fig 2 for 5±1 s. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
a
b
c
4.5
8.0
5.6
(in mm)
20 50
Pressurizing
speed:1.0mm/s
Pressurize
R4
Flexure: 5mm
Capacitance meter
45
45
Fig.1
Fig.2
18
Terminal
Strength
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig.3 using solder. Then apply 18N force in parallel with the test
jig for 60 s.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
Appearance
Capacitance
Q
No marking defects
Within specified tolerance
Q ≧ 500
I.R.
More than 10,000M or 500 MF
(Whichever is smaller)
a
b
c
4.0
8.0
5.6
(in mm)
Fig.3
19
Beam Load Test
Destruction value should be exceed
following one.
Place the capacitor in the beam load fixture as in Fig 4.
Apply a force.
15N
0.6L
Fig.4
Speed supplied the Stress Load : 2.5mm / s
20
Capacitance
Temperature
Characteristics
Capacitance
Change
-750±120 ppm/°C
The capacitance change should be measured after 5 min. at
each specified temperature stage.
(Temp.Range:+25 to +125°C)
-750+120,-347 ppm/°C
(Temp.Range:-55 to +25°C)
Within 0.5% or 0.05 pF
(Whichever is larger.)
Step
Temperature(C)
1
2
3
4
5
252
Min. Operating Temp. 3
252
Capacitance
Drift
Max. Operating Temp. 3
252
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
ESKCM5503
17/19