Datasheet > KB207

KB207

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
DAESAN		/
页数	文件大小	规格书
2页	236K
描述
CURRENT 2.0 Amperes VOLTAGE 50 to 1000 Volts

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KB207 数据手册

CURRENT 2.0 Amperes

VOLTAGE 50 to 1000 Volts

KB201 THRU KB207

Features

· Glass Passivated Die Construction

· Diffused Junction

· Low Forward Voltage Drop, High Current Capability

· Surge Overload Rating to 60A Peak

· Ideal for Printed Circuit Boards

· Case to Terminal Isolation Voltage 1500V

· Plastic Material - UL Flammability Classification 94V-0

WOB

Dim

Min

8.84

4.00

27.90

25.40

0.71

4.60

Max

9.86

4.60

Mechanical Data

· Case : WOB Molded Plastic

· Terminals : Plated Leads Solderable per

MIL-STD-202, Method 208

· Polarity : As Marked on Case

· Weight : 1.3 grams (approx.)

· Mounting Position : Any

0.81

5.60

All Dimens ions in mm

· Marking : Type Number

Maximum Ratings And Electrical Characteristics

(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

Symbols KB201 KB202 KB203 KB204 KB205 KB206 KB207

Units

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMM

RWM

100

200

140

400

600

420

800

560

1000

700

Volts

RMS Reverse Voltage

R(RMS)

280

2.0

Volts

Average Rectified Output Current @ T

=25

Amps

℃

Non-Repetitive Peak Forward Surge Current,

8.3ms single half-sine-wave superimposed

on rated load per element (JEDEC method)

FSM

Amps

VFM

1.1

Volts

Forward Voltage (per element)

@ IF=2.0 A

@ T

=25℃

5.0

Peak Reverse Current at Rated

DC Blocking Voltage

μA

@ T

=125℃

500

Typical Junction Capacitance (Note 2)

℃/W

Typical Thermal Resistance Junction to Case

Operating and Storage Temperature Range

RθJC

STG

-65 to +150

℃

Notes:

(1) Thermal resistance from junction to case mounted in PC board with 13 x 13mm (0.03mm thick) land areas.

(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.

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