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KB156 PDF预览

KB156

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
DAESAN /
页数 文件大小 规格书
2页 225K
描述
CURRENT 1.5 Amperes VOLTAGE 50 to 1000 Volts

KB156 数据手册

 浏览型号KB156的Datasheet PDF文件第2页 
CURRENT 1.5 Amperes  
VOLTAGE 50 to 1000 Volts  
KB151 THRU KB157  
Features  
· Glass Passivated Die Construction  
· Diffused Junction  
· Low Forward Voltage Drop, High Current Capability  
· Surge Overload Rating to 50A Peak  
· Ideal for Printed Circuit Boards  
· Case to Terminal Isolation Voltage 1500V  
· Plastic Material - UL Flammability  
Classification Rating 94V-0  
A
B
C
+
-
D
WOB  
Dim  
A
Min  
8.84  
4.00  
27.90  
25.40  
0.71  
4.60  
Max  
9.86  
4.60  
E
Mechanical Data  
B
C
· Case : WOB, Molded Plastic  
· Terminals : Plated Leads Solderable per  
MIL-STD-202, Method 208  
· Polarity : As Marked on Body  
· Weight : 1.3 grams (approx.)  
· Mounting Position : Any  
-
D
+
E
0.81  
5.60  
G
G
G
All Dimens ions in mm  
· Marking : Type Number  
Maximum Ratings And Electrical Characteristics  
(Ratings at 25ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive  
load. For capacitive load, derate by 20%)  
Symbols  
Units  
KB151 KB152 KB153 KB154 KB155 KB156 KB157  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
V
RMM  
RWM  
50  
35  
100  
70  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
Volts  
R
RMS Reverse Voltage  
V
RMS  
280  
1.5  
Volts  
Average Rectified Output Current @ T  
A
=25  
Io  
Amps  
Non-Repetitive Peak Forward Surge Current,  
8.3ms single half-sine-wave superimposed  
on rated load (JEDEC method)  
I
FSM  
50  
Amps  
Volts  
V
FM  
1.0  
Forward Voltage (per element)  
@ IF=1.5 A  
@ T  
A
A
=25℃  
5.0  
500  
12  
Peak Reverse Current at Rated  
DC Blocking Voltage  
I
RM  
μA  
pF  
@ T  
=100℃  
C
j
Typical Junction Capacitance (Note 1)  
Typical Thermal Resistance,  
Junction to Case (Note 2)  
84  
/W  
RθJA  
T
STG  
j
Operating and Storage Temperature Range  
-65 to +150  
T
Notes:  
(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.  
(2) Thermal Resistance from junction to case mounted on PC board with 13 x 13mm (0.03mm thick) land areas.  

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