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K7J323682M PDF预览

K7J323682M

更新时间: 2022-11-26 22:08:42
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器双倍数据速率
页数 文件大小 规格书
17页 307K
描述
1Mx36 & 2Mx18 DDR II SIO b2 SRAM

K7J323682M 数据手册

 浏览型号K7J323682M的Datasheet PDF文件第2页浏览型号K7J323682M的Datasheet PDF文件第3页浏览型号K7J323682M的Datasheet PDF文件第4页浏览型号K7J323682M的Datasheet PDF文件第5页浏览型号K7J323682M的Datasheet PDF文件第6页浏览型号K7J323682M的Datasheet PDF文件第7页 
K7J323682M  
K7J321882M  
1Mx36 & 2Mx18 DDR II SIO b2 SRAM  
Document Title  
1Mx36-bit, 2Mx18-bit DDR II SIO b2 SRAM  
Revision History  
Draft Date  
Remark  
Rev. No.  
History  
Advance  
Preliminary  
July, 15 2001  
Dec, 14 2001  
0.0  
1. Initial document.  
0.1  
1. Pin name change from DLL to Doff  
2. Update JTAG test conditions.  
3. Reserved pin for high density name change from NC to Vss/SA  
4. Delete AC test condition about Clock Input timing Reference Level  
5. Delete clock description on page 2 and add HSTL I/O comment  
6. Deleted R/W control pin description on page 2  
Preliminary  
Preliminary  
Preliminary  
July, 29. 2002  
Sep. 6. 2002  
Oct. 7. 2002  
0.2  
0.3  
0.4  
1. Update current characteristics in DC electrical characteristics  
2. Change AC timing characteristics  
3. Update JTAG instruction coding and diagrams  
1. Add AC electrical characteristics.  
2. Change AC timing characteristics.  
3. Change DC electrical characteristics(ISB1)  
1. Change the data Setup/Hold time.  
2. Change the Access Time.(tCHQV, tCHQX, etc.)  
3. Change the Clock Cycle Time.(MAX value of tKHKH)  
4. Change the JTAG instruction coding.  
Preliminary  
Dec. 16, 2002  
0.5  
1. Change the Boundary scan exit order.  
2. Change the AC timing characteristics(-25, -20)  
3. Correct the Overshoot and Undershoot timing diagrams.  
Preliminary  
Preliminary  
Dec. 26, 2002  
Mar. 20, 2003  
0.6  
0.7  
1. Change the JTAG Block diagram  
1. Correct the JTAG ID register definition  
2. Correct the AC timing parameter (delete the tKHKH Max value)  
Preliminary  
April. 4, 2003  
0.8  
1. Change the Maximum Clock cycle time.  
2. Correct the 165FBGA package ball size.  
Final  
Final  
Final  
Oct. 31, 2003  
Dec. 1, 2003  
Dec. 13, 2004  
1.0  
2.0  
2.1  
1. Final spec release  
1. Delete the x8 Org. part  
1. Change the operating current parameter  
before  
230  
200  
after  
250  
230  
220  
Isb1  
-25 :  
-20 :  
-16 :  
190  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Dec. 2004  
Rev 2.1  
- 1 -  

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