Industrial Temperature
K4F660412D,K4F640412D
CMOS DRAM
AC CHARACTERISTICS (Continued)
-45
-50
-60
Parameter
Symbol
Units
Note
Min
Max
64
Min
Max
64
Min
Max
64
Refresh period (Normal)
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
ns
ns
tREF
tREF
tWCS
tCWD
tRWD
tAWD
tCPWD
tCSR
tCHR
tRPC
tCPA
tPC
Refresh period (L-ver)
128
128
128
Write command set-up time
0
0
0
38
83
53
60
5
7
7
7
7
CAS to W delay time
32
67
43
48
5
36
73
48
53
5
RAS to W delay time
Column address toW delay time
CAS precharge W delay time
CAS set-up time (CAS -before-RAS refresh)
CAS hold time (CAS -before-RAS refresh)
RAS to CAS precharge time
10
5
10
5
10
5
Access time from CAS precharge
Fast Page mode cycle time
26
30
35
3
31
70
9
35
76
10
50
30
40
85
10
60
35
Fast Page mode read-modify-write cycle time
CAS precharge time (Fast page cycle)
RAS pulse width (Fast page cycle)
RAS hold time from CAS precharge
OE access time
tPRWC
tC P
tRASP
tRHCP
tOEA
tOED
tOEZ
tOEH
tWTS
tWTH
tWRP
tWRH
tRASS
tRPS
tCHS
45
28
200K
12
200K
13
200K
15
3
6
OE to data delay
12
0
13
0
13
0
Output buffer turn off delay time from OE
OE command hold time
13
13
13
12
10
15
10
10
100
80
-50
13
10
15
10
10
100
90
-50
15
Write command set-up time (Test mode in)
Write command hold time (Test mode in)
W to RAS precharge time (C-B-R refresh)
W to RAS hold time (C-B-R refresh)
RAS pulse width (C-B-R self refresh)
RAS precharge time (C-B-R self refresh)
CAS hold time (C-B-R self refresh)
10
11
11
15
10
10
100
110
-50
13,14,15
13,14,15
13,14,15