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K4B4G0446B-MCH9 PDF预览

K4B4G0446B-MCH9

更新时间: 2024-01-04 20:49:21
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率
页数 文件大小 规格书
59页 1074K
描述
DDP 4Gb B-die DDR3 SDRAM Specification

K4B4G0446B-MCH9 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FBGA, BGA78,9X13,32
Reach Compliance Code:compliant风险等级:5.84
最大时钟频率 (fCLK):667 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B78JESD-609代码:e3
内存密度:4294967296 bit内存集成电路类型:DDR DRAM
内存宽度:4湿度敏感等级:1
端子数量:78字数:1073741824 words
字数代码:1000000000最高工作温度:85 °C
最低工作温度:组织:1GX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA78,9X13,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):225电源:1.5 V
认证状态:Not Qualified刷新周期:8192
最大待机电流:0.024 A子类别:DRAMs
最大压摆率:0.3 mA标称供电电压 (Vsup):1.5 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:MATTE TIN
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

K4B4G0446B-MCH9 数据手册

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K4B4G0446B  
K4B4G0846B  
DDP 4Gb DDR3 SDRAM  
DDP 4Gb B-die DDR3 SDRAM Specification  
78 FBGA with Lead-Free & Halogen-Free  
(RoHS Compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE  
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-  
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-  
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT  
GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.0 March 2009  
Page 1 of 59  

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