是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP2 | 包装说明: | TSOP2, |
针数: | 44 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.71 |
风险等级: | 5.92 | 最长访问时间: | 150 ns |
备用内存宽度: | 8 | JESD-30 代码: | R-PDSO-G44 |
长度: | 18.41 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 44 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | ASYNCHRONOUS | 组织: | 2MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP2 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | GULL WING |
端子节距: | 0.8 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 10.16 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
K3P6V1000D-YC | SAMSUNG | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
获取价格 |
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K3P6V1000D-YC10 | SAMSUNG | MASK ROM, 4MX8, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
获取价格 |
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K3P6V1000D-YE | SAMSUNG | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
获取价格 |
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K3P6V1000D-YE10 | SAMSUNG | MASK ROM, 4MX8, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
获取价格 |
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K3P6V1000F-GC100 | SAMSUNG | MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, SOP-44 |
获取价格 |
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K3P6V1000F-GC120 | SAMSUNG | MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.500 INCH, SOP-44 |
获取价格 |