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JS-9MD-KT-V3 PDF预览

JS-9MD-KT-V3

更新时间: 2024-02-24 12:28:02
品牌 Logo 应用领域
富士通 - FUJITSU PC继电器
页数 文件大小 规格书
9页 616K
描述
Electromechanical Relay, SPST, 225mW (Coil), 8A (Contact), 24VDC (Contact), DC Output

JS-9MD-KT-V3 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.57主体宽度:10 mm
主体高度:12.5 mm主体长度或直径:29 mm
线圈工作电压(直流):6.3 V线圈功率:225 mW
线圈释放电压(直流):0.9 V线圈电阻:360 Ω
标称线圈电压:9 V线圈/输入电源类型:DC
触点(交流)最大额定R负载:8A@250VAC最大触点电流(交流):8 A
最大触点电流(直流):8 A触点(直流)最大额定R负载:8A@24VDC
最大触点电压(交流):250 V最大触点电压(直流):24 V
触点/输出电源类型:DC线圈与触点之间的介电强度:4000 Vrms
断开触点之间的介电强度:1000 Vrms电气寿命:100000 Cycle(s)
绝缘电阻:1000000000 Ω端子数量:4
工作时间:10 ms最高工作温度:85 °C
最低工作温度:-40 °CPCB 孔数:4
物理尺寸:29mm x 10mm x 12.5mm参考标准:BSI; CSA; FIMKO; OVE; SEMKO; SEV; UL; VDE
继电器样式:1 FORM A继电器功能:SPST
释放时间:5 ms密封:PLASTIC SEALED
端子长度:0.003 inch端接类型:SOLDER
重量:8 gBase Number Matches:1

JS-9MD-KT-V3 数据手册

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JS SERIES  
RoHS Compliance and Lead Free Relay Information  
1. General Information  
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Relays produced after the specific date code that is indicated on each data sheet are lead-free  
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.  
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)  
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.  
All signal and most power relays also comply with RoHS. Please refer to individual data  
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that  
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).  
It has been verified that using lead-free relays in leaded assembly process will not cause any  
problems (compatible).  
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“LF” is marked on each outer and inner carton. (No marking on individual relays).  
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.  
We will ship leaded relays as long as the leaded relay inventory exists.  
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)  
2. Recommended Lead Free Solder Profile  
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Recommended solder paste Sn-3.0Ag-0.5Cu.  
Reflow Solder condtion  
Flow Solder condtion:  
Pre-heating:  
Soldering:  
maximum 120˚C  
dip within 5 sec. at  
260˚C soler bath  
Solder by Soldering Iron:  
SolderingꢀIronꢀ  
Temperature: maximum 360˚C  
Duration:  
maximum 3 sec.  
We highly recommend that you confirm your actual solder conditions  
3. Moisture Sensitivity  
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Moisture Sensitivity Level standard is not applicable to electromechanical realys.  
4. Tin Whisker  
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Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in  
house test.  
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