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JANKCA1N4565A PDF预览

JANKCA1N4565A

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
CDI-DIODE /
页数 文件大小 规格书
21页 858K
描述
Zener Diode, 6.4V V(Z), 5%, 0.5W, Silicon, HERMETIC SEALED, DIE-3

JANKCA1N4565A 数据手册

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MIL-PRF-19500/452G  
2. APPLICABLE DOCUMENTS  
* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This  
section does not include documents cited in other sections of this specification or recommended for additional  
information or as examples. While every effort has been made to ensure the completeness of this list, document  
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this  
specification, whether or not they are listed.  
2.2 Government documents.  
* 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a  
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are  
those cited in the solicitation or contract.  
*
*
*
DEPARTMENT OF DEFENSE SPECIFICATIONS  
MIL-PRF-19500 Semiconductor Devices, General Specification for.  
DEPARTMENT OF DEFENSE STANDARDS  
MIL-STD-750 Test Methods for Semiconductor Devices.  
-
-
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or  
http://www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,  
Philadelphia, PA  
19111-5094.)  
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited  
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws  
and regulations unless a specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.  
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a  
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)  
before contract award (see 4.2 and 6.3).  
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as  
specified in MIL-PRF-19500.  
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in  
MIL-PRF-19500 and figures 1, 2, 3, 4, and 5 herein.  
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.  
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).  
3.4.2 Diode construction. These devices shall be constructed in a manner and using material which enable the  
diodes to meet the applicable requirements of MIL-PRF-19500 and this document.  
3

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