IXDD509 / IXDE509
9 Ampere Low-Side Ultrafast MOSFET Drivers
with Enable for fast, controlled shutdown
Features
General Description
• Built using the advantages and compatibility
of CMOS and IXYS HDMOSTM processes
• Latch-Up Protected up to 9 Amps
• High 9A peak output current
• Wide operating range: 4.5V to 30V
• -55°Cto+125°CExtendedoperating
temperature
• Ability to disable output under faults
• High capacitive load drive capability:
1800pF in <15ns
TheIXDD509andIXDE509arehighspeedhighcurrentgate
drivers specifically designed to drive the largest IXYS
MOSFETs & IGBTs to their minimum switching time and
maximumparcticalfrequencylimits. TheIXDD509and
IXDE509 can source and sink 9 Amps of Peak Current
while producing voltage rise and fall times of less than
30ns. The inputs of the Drivers are compatible with TTL or
CMOS and are virtually immune to latch up over the entire
operatingrange.Patented*designinnovationseliminate
crossconductionandcurrent"shoot-through".Improved
speedanddrivecapabilitiesarefurtherenhancedby
matched rise and fall times.
• Matched rise and fall times
• Low propagation delay time
• Lowoutputimpedance
TheIXDD509andIXDE509incorporateauniqueabilityto
disable the output under fault conditions. When a logical
low is forced into the Enable input, both final output stage
MOSFETs, (NMOS and PMOS) are turned off. As a result,
the output of the IXDD509 or IXDE509 enters a tristate high
impedance mode and with additional circuitry, achieves a
Soft Turn-Off of the MOSFET/IGBT when a short circuit is
detected. This helps prevent damage that could occur to
the MOSFET/IGBT if it were to be switched off abruptly due
toadv/dtover-voltagetransient.
• Low supply current
Applications
• DrivingMOSFETsandIGBTs
• Limiting di/dt under short circuit
• Motorcontrols
• Linedrivers
• Pulsegenerators
• Local power ON/OFF switch
• Switch mode power supplies (SMPS)
• DCtoDCconverters
• Pulsetransformerdriver
• Class D switching amplifiers
• Powerchargepumps
TheIXDD509andIXDE509areavailableinthe8-PinP-DIP
(PI) package, the 8-Pin SOIC (SIA) package, and the 6-
Lead DFN (D1) package, (which occupies less than 65% of
the board area of the 8-Pin SOIC).
*United States Patent 6,917,227
OrderingInformation
Package
Type
Pack
Qty
50
94
2500
56
2500
50
94
2500
56
2500
Part Number
Description
Packing Style
Tube
Configuration
IXDD509PI
IXDD509SIA
IXDD509SIAT/R 9A Low Side Gate Driver I.C.
IXDD509D1
IXDD509D1T/R
IXDE509PI
IXDE509SIA
IXDE509SIAT/R 9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
Tube
Non-Inverting
with Enable
13” Tape and Reel
2” x 2” Waffle Pack
13” Tape and Reel
Tube
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
Tube
Inverting
with Enable
13” Tape and Reel
2” x 2” Waffle Pack
13” Tape and Reel
IXDE509D1
IXDE509D1T/R
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
NOTE: All parts are lead-free and RoHS Compliant
Copyright © 2007 IXYS CORPORATION All rights reserved
DS99679A(10/07)
First Release