Datasheet > ISL9113ERAZ-EVZ

ISL9113ERAZ-EVZ

更新时间： 2022-02-26 10:01:46

品牌	Logo	应用领域
瑞萨 - RENESAS		/
页数	文件大小	规格书
15页	1003K
描述
Low Input Voltage and High Efficiency Synchronous Boost Converter with 1.3A Switch

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ISL9113ERAZ-EVZ 数据手册

ISL9113

Package Outline Drawing

W3x2.6

3X2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLSCP 0.4MM PITCH)

Rev 3, 1/13

1.360±0.03

0.280

0.200

0.800

0.800±0.03

0.10

PIN 1

(4X)

0.400

0.200

(A1 CORNER)

TOP VIEW

6X 0.265±0.035

BOTTOM VIEW

PACKAGE

OUTLINE

0.240

0.10

0.05

Z X Y

SEATING PLANE

0.400

0.265±0.035

0.200±0.030

0.05 Z

0.290

0.500±0.050

NSMD

TYPICAL RECOMMENDED LAND PATTERN

SIDE VIEW

NOTES:

1. Dimensions and tolerance per ASME Y 14.5M - 1994.

2. Dimension is measured at the maximum bump diameter

parallel to primary datum Z .

3. Primary datum Z and seating plane are defined by the spherical

crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010.

5. All dimensions are in millimeters.

6. NSMD refers to non-solder mask defined pad design per Intersil

Tech Brief www.intersil.com/data/tb/tb451.pdf

7. Ball height and post saw device size can vary by ±10µm

depending on final selection of assembly vendor.

FN8313 Rev 3.00

February 23, 2015

Page 15 of 15

1...12 13 1415

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