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ISL8843MBZ-T PDF预览

ISL8843MBZ-T

更新时间: 2024-01-04 18:48:57
品牌 Logo 应用领域
英特矽尔 - INTERSIL 开关光电二极管控制器
页数 文件大小 规格书
12页 305K
描述
Industry Standard Single-Ended Current Mode PWM Controller

ISL8843MBZ-T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:MSOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.6
Is Samacsys:N模拟集成电路 - 其他类型:SWITCHING CONTROLLER
控制模式:CURRENT-MODE控制技术:PULSE WIDTH MODULATION
最大输入电压:30 V最小输入电压:8 V
标称输入电压:15 VJESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-55 °C最大输出电流:1 A
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP8,.19封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Switching Regulator or Controllers表面贴装:YES
切换器配置:SINGLE最大切换频率:2000 kHz
温度等级:MILITARY端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:3 mmBase Number Matches:1

ISL8843MBZ-T 数据手册

 浏览型号ISL8843MBZ-T的Datasheet PDF文件第6页浏览型号ISL8843MBZ-T的Datasheet PDF文件第7页浏览型号ISL8843MBZ-T的Datasheet PDF文件第8页浏览型号ISL8843MBZ-T的Datasheet PDF文件第9页浏览型号ISL8843MBZ-T的Datasheet PDF文件第10页浏览型号ISL8843MBZ-T的Datasheet PDF文件第11页 
ISL8843  
Mini Small Outline Plas tic Packages (MSOP)  
N
M8.118 (JEDEC MO-187AA)  
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE  
INCHES  
MILLIMETERS  
E1  
E
SYMBOL  
MIN  
MAX  
MIN  
0.94  
0.05  
0.75  
0.25  
0.09  
2.95  
2.95  
MAX  
1.10  
0.15  
0.95  
0.36  
0.20  
3.05  
3.05  
NOTES  
A
A1  
A2  
b
0.037  
0.002  
0.030  
0.010  
0.004  
0.116  
0.116  
0.043  
0.006  
0.037  
0.014  
0.008  
0.120  
0.120  
-
-B-  
0.20 (0.008)  
INDEX  
AREA  
1 2  
A
B
C
-
-
TOP VIEW  
4X θ  
9
0.25  
(0.010)  
R1  
L
c
-
R
GAUGE  
PLANE  
D
3
E1  
e
4
SEATING  
PLANE  
0.026 BSC  
0.65 BSC  
-
-C-  
4X θ  
L1  
A
A2  
E
0.187  
0.199  
4.75  
5.05  
-
L
0.016  
0.028  
0.40  
0.70  
6
SEATING  
PLANE  
L1  
N
0.037 REF  
0.95 REF  
-
0.10 (0.004)  
-A-  
C
C
b
8
8
7
-H-  
A1  
e
R
0.003  
0.003  
-
-
0.07  
0.07  
-
-
-
D
0.20 (0.008)  
C
R1  
0
-
o
o
o
o
5
15  
5
15  
-
a
SIDE VIEW  
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-  
Rev. 2 01/03  
0.20 (0.008)  
C
D
END VIEW  
NOTES:  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-187BA.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs and are measured at Datum Plane. Mold flash, protrusion  
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions  
- H -  
and are measured at Datum Plane.  
Interlead flash and  
protrusions shall not exceed 0.15mm (0.006 inch) per side.  
5. Formed leads shall be planar with respect to one another within  
0.10mm (0.004) at seating Plane.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
- B -  
-A -  
10. Datums  
and  
to be determined at Datum plane  
.
- H -  
11. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN9238.0  
12  
October 19, 2005  

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