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ISL75052SEHF/SAMPLE PDF预览

ISL75052SEHF/SAMPLE

更新时间: 2022-02-26 10:50:26
品牌 Logo 应用领域
英特矽尔 - INTERSIL /
页数 文件大小 规格书
16页 657K
描述
1.5A, Rad Hard, Positive, High Voltage LDO

ISL75052SEHF/SAMPLE 数据手册

 浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第10页浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第11页浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第12页浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第13页浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第14页浏览型号ISL75052SEHF/SAMPLE的Datasheet PDF文件第15页 
ISL75052SEH  
Package Outline Drawing  
K16.E  
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
Rev 1, 1/12  
0.015 (0.38)  
PIN NO. 1  
0.008 (0.20) ID OPTIONAL  
1
2
A
A
0.050 (1.27 BSC)  
PIN NO. 1  
ID AREA  
0.420  
0.400  
0.005 (0.13)  
MIN  
4
TOP VIEW  
0.022 (0.56)  
0.015 (0.38)  
0.115 (2.92)  
0.009 (0.23)  
0.004 (0.10)  
0.045 (1.14)  
0.026 (0.66)  
0.085 (2.16)  
6
0.278 (7.06)  
0.262 (6.65)  
-D-  
-H-  
-C-  
0.370 (9.40)  
0.250 (6.35)  
0.198 (5.03)  
0.182 (4.62)  
BOTTOM  
METAL  
0.03 (0.76) MIN  
7
SEATING AND  
BASE PLANE  
SIDE VIEW  
BOTTOM METAL  
0.005 (0.127) REF.  
OFFSET FROM  
CERAMIC EDGE  
OPTIONAL  
PIN 1 INDEX  
BOTTOM VIEW  
NOTES:  
Index area: A notch or a pin one identification mark shall be located  
adjacent to pin one and shall be located within the shaded area shown.  
The manufacturer’s identification shall not be used as a pin one  
identification mark. Alternately, a tab may be used to identify pin one.  
1.  
0.006 (0.15)  
0.004 (0.10)  
LEAD FINISH  
2. If a pin one identification mark is used in addition to a tab, the limits  
of the tab dimension do not apply.  
0.009 (0.23)  
0.004 (0.10)  
BASE  
METAL  
3. The maximum limits of lead dimensions (section A-A) shall be  
measured at the centroid of the finished lead surfaces, when solder  
dip or tin plate lead finish is applied.  
0.019 (0.48)  
0.015 (0.38)  
4. Measure dimension at all four corners.  
0.0015 (0.04)  
MAX  
5. For bottom-brazed lead packages, no organic or polymeric materials  
shall be molded to the bottom of the package to cover the leads.  
0.022 (0.56)  
0.015 (0.38)  
6. Dimension shall be measured at the point of exit (beyond the  
meniscus) of the lead from the body. Dimension minimum shall  
be reduced by 0.0015 inch (0.038mm) maximum when solder dip  
lead finish is applied.  
3
SECTION A-A  
7. The bottom of the package is a solderable metal surface.  
8. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
9. Dimensions: INCH (mm). Controlling dimension: INCH.  
FN8456.0  
May 29, 2013  
16  

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