ISL6615IBZ-T PDF预览

ISL6615IBZ-T

更新时间: 2025-09-19 19:17:39
品牌 Logo 应用领域
瑞萨 - RENESAS 驱动驱动器栅极
页数 文件大小 规格书
11页 626K
描述
最小供电电压(V):6.8V;最大供电电压(V):13.2V;峰值输出灌电流(A):2.5A;峰值输出拉电流(A):4A;驱动配置:半桥;通道类型:同步;驱动器数:2;栅极类型:N 沟道 MOSFET;上升时间(ns):13ns;下降时间(ns):10ns;元器件封装:8-SOIC;

ISL6615IBZ-T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SOP, SOP8,.25
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.61高边驱动器:YES
接口集成电路类型:AND GATE BASED MOSFET DRIVERJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.9 mm
湿度敏感等级:3功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C标称输出峰值电流:6 A
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:12 V认证状态:Not Qualified
座面最大高度:1.75 mm子类别:MOSFET Drivers
最大供电电压:13.2 V最小供电电压:6.8 V
标称供电电压:12 V电源电压1-最大:13.2 V
电源电压1-分钟:5 V电源电压1-Nom:12 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3.9 mm
Base Number Matches:1

ISL6615IBZ-T 数据手册

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DATASHEET  
ISL6615  
FN6481  
Rev 0.00  
April 24, 2008  
High-Frequency 6A Sink Synchronous MOSFET Drivers with Protection Features  
The ISL6615 is a high-speed MOSFET driver optimized to  
drive upper and lower power N-Channel MOSFETs in a  
Features  
• Dual MOSFET Drives for Synchronous Rectified Bridge  
synchronous rectified buck converter topology. This driver,  
combined with an Intersil Digital or Analog multiphase PWM  
controller, forms a complete high frequency and high  
efficiency voltage regulator.  
• Advanced Adaptive Zero Shoot-Through Protection  
- Body Diode Detection  
- LGATE Detection  
- Auto-zero of r  
DS(ON)  
Conduction Offset Effect  
The ISL6615 drives both upper and lower gates over a range  
of 4.5V to 13.2V. This drive-voltage provides the flexibility  
necessary to optimize applications involving trade-offs  
between gate charge and conduction losses.  
• Adjustable Gate Voltage for Optimal Efficiency  
• 36V Internal Bootstrap Schottky Diode  
• Bootstrap Capacitor Overcharging Prevention  
The ISL6615 features 6A typical sink current for the low-side  
gate driver, enhancing the lower MOSFET gate hold-down  
capability during PHASE node rising edge, preventing power  
loss caused by the self turn-on of the lower MOSFET due to  
the high dV/dt of the switching node.  
• Supports High Switching Frequency (up to 1MHz)  
- 6A LGATE Sinking Current Capability  
- Fast Rise/Fall Times and Low Propagation Delays  
• Support 3.3V PWM Input logic  
An advanced adaptive zero shoot-through protection is  
integrated to prevent both the upper and lower MOSFETs  
from conducting simultaneously and to minimize the dead  
time. The ISL6615 includes an overvoltage protection  
feature operational before VCC exceeds its turn-on  
threshold, at which the PHASE node is connected to the  
gate of the low side MOSFET (LGATE). The output voltage  
of the converter is then limited by the threshold of the low  
side MOSFET, which provides some protection to the load if  
the upper MOSFET(s) is shorted.  
• Tri-State PWM Input for Safe Output Stage Shutdown  
• Tri-State PWM Input Hysteresis for Applications with  
Power Sequencing Requirement  
• Pre-POR Overvoltage Protection  
• VCC Undervoltage Protection  
• Expandable Bottom Copper PAD for Better Heat  
Spreading  
• Dual Flat No-Lead (DFN) Package  
The ISL6615 also features an input that recognizes a  
high-impedance state, working together with Intersil  
multiphase PWM controllers to prevent negative transients  
on the controlled output voltage when operation is  
suspended. This feature eliminates the need for the Schottky  
diode that may be utilized in a power system to protect the  
load from negative output voltage damage.  
- Near Chip-Scale Package Footprint; Improves PCB  
Efficiency and Thinner in Profile  
• Pb-Free (RoHS Compliant)  
Applications  
• Optimized for POL DC/DC Converters for IBA Systems  
• Core Regulators for Intel® and AMD® Microprocessors  
• High Current Low-Profile DC/DC Converters  
• High Frequency and High Efficiency VRM and VRD  
• Synchronous Rectification for Isolated Power Supplies  
Related Literature  
Technical Brief TB363 “Guidelines for Handling and  
Processing Moisture Sensitive Surface Mount Devices  
(SMDs)”  
Technical Brief TB389 “PCB Land Pattern Design and  
Surface Mount Guidelines for QFN Packages”  
FN6481 Rev 0.00  
April 24, 2008  
Page 1 of 11  

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