ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
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DATE
REVISION
FN7765.6
CHANGE
Feb 8, 2019
Updated links throughout document.
Updated ordering information table by adding all tape and reel information and updating notes.
Updated last sentence in the “High Overvoltage (Fault) Protection Increases Ruggedness” section.
Removed About Intersil section.
Updated disclaimer.
Sep 18, 2017
Apr 20, 2015
FN7765.5
FN7786.4
Added Related Literature section.
Updated Receiving Truth Table on page 3.
Applied Intersil A Renesas Company template.
DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL32490E, ISL32492E) Changed MAX limit
from “1200” to “1350” in “Driver Differential Rise or Fall Time” on page 6 that has -25V ≤ V ≤ 25V for
CM
test condition.
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL32493E, ISL32495E) Changed MAX limit from
“400” to “550” in “Driver Differential Rise or Fall Time” on page 7 that has -25V ≤ V ≤ 25V for test
CM
condition.
Oct 14, 2014
Mar 7, 2012
Nov 11, 2011
FN7786.3
FN7786.2
FN7786.1
On page 7, added “Note 17” reference to the Driver Differential Output Test condition.
On page 9, added Note 17, “This parameter is not production tested.”
On page 19 replaced M10.118 POD with latest revision.
Updated Figure 16 on page 12 to show Pos breakdown between 60V and 70V.
Updated Theta JA in “Thermal Information” on page 5 for 8 Ld SOIC from 116 to 108.
Updated Package Outline Drawing on page 21. Changed Note 1 "1982" to "1994".
Added 10 to “Pin Count” for ISL32490E, ISL32493E, ISL32496E in the Summary of Features table.
Added 10 Ld MSOP option for ISL32490E, ISL32493E, ISL32496E in the “Ordering Information” table.
Added 10 Ld MSOP pinout to “Pin Configurations” for ISL32490E, ISL32493E, ISL32496E.
Added 10 Ld Pin # column in the “Pin Description” table.
Added “(SOIC pin numbers shown)” in the “Typical Operating Circuits”.
Added 10 Ld MSOP information in the “Thermal Resistance” section.
Added 10 Ld MSOP package outline drawing.
M8.118 on page 18- Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36"
M8.15 on page 21- In Typical Recommended Land Pattern, changed the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
Jan 18, 2011
FN7786.0
Initial release
FN7786 Rev.6.00
Feb 8, 2019
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