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ISL3175EIBZ

更新时间: 2024-02-12 07:03:18
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器接口集成电路光电二极管信息通信管理PC
页数 文件大小 规格书
19页 803K
描述
【15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers

ISL3175EIBZ 技术参数

生命周期:Unknown零件包装代码:MSOP, SOIC
包装说明:TSSOP, TSSOP8,.19针数:8, 8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:8 weeks
风险等级:5.3差分输出:YES
驱动器位数:1高电平输入电流最大值:0.000002 A
输入特性:DIFFERENTIAL SCHMITT TRIGGER接口集成电路类型:LINE TRANSCEIVER
接口标准:EIA-422; EIA-485JESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:3 mm
湿度敏感等级:2功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C最小输出摆幅:1.5 V
最大输出低电流:0.004 A封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP8,.19
封装形状:SQUARE封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:120 ns
接收器位数:1座面最大高度:1.1 mm
子类别:Line Driver or Receivers最大压摆率:0.8 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30最大传输延迟:700 ns
宽度:3 mmBase Number Matches:1

ISL3175EIBZ 数据手册

 浏览型号ISL3175EIBZ的Datasheet PDF文件第2页浏览型号ISL3175EIBZ的Datasheet PDF文件第3页浏览型号ISL3175EIBZ的Datasheet PDF文件第4页浏览型号ISL3175EIBZ的Datasheet PDF文件第6页浏览型号ISL3175EIBZ的Datasheet PDF文件第7页浏览型号ISL3175EIBZ的Datasheet PDF文件第8页 
ISL3170E,ISL3171E,ISL3172E,ISL3173E,ISL3174E,ISL3175E,ISL3176E,ISL3177E,ISL3178E  
Absolute Maximum Ratings  
Thermal Information  
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V  
Thermal Resistance (Typical, Note 3)  
θJA (°C/W)  
CC  
Input Voltages  
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .  
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .  
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .  
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C  
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C  
(Lead Tips Only)  
+105  
+140  
+190  
+128  
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V  
Input/Output Voltages  
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V  
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V  
Short Circuit Duration  
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous  
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table  
+0.3V)  
CC  
Operating Conditions  
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
Electrical Specifications Test Conditions: V = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V  
= 3.3V, T = +25°C,  
A
CC  
CC  
Note 4  
TEMP  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
(°C)  
MIN  
TYP  
MAX UNITS  
DC CHARACTERISTICS  
Driver Differential V  
V
R
R
= 100Ω (RS-422) (Figure 1A, Note 15)  
= 54Ω (RS-485) (Figure 1A)  
Full  
Full  
2
1.5  
-
2.3  
2
-
V
V
OUT  
OD  
L
V
V
L
CC  
No Load  
-
CC  
-
R
R
= 60Ω, -7V V  
12V (Figure 1B)  
CM  
Full  
Full  
1.5  
-
2.2  
0.01  
V
V
L
Change in Magnitude of Driver  
Differential V for  
ΔV  
= 54Ω or 100Ω (Figure 1A)  
0.2  
OD  
L
OUT  
Complementary Output States  
Driver Common-Mode V  
V
R
R
= 54Ω or 100Ω (Figure 1A)  
= 54Ω or 100Ω (Figure 1A)  
Full  
Full  
-
-
2
3
V
V
OUT  
Change in Magnitude of Driver  
Common-Mode V for  
OC  
L
ΔV  
0.01  
0.2  
OC  
L
OUT  
Complementary Output States  
Logic Input High Voltage  
Logic Input Low Voltage  
Logic Input Hysteresis  
V
DI, DE, RE  
Full  
Full  
25  
2
-
-
-
0.8  
-
V
IH  
V
DI, DE, RE  
-
-
V
IL  
V
DE, RE (Note 14)  
DI = DE = RE = 0V or V  
100  
-
mV  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
HYS  
Logic Input Current  
I
(Note 17)  
CC  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
-2  
-
2
IN1  
IN2  
Input Current (A, B, A/Y, B/Z)  
I
I
I
DE = 0V, V  
3.6V  
= 0V or  
V
V
V
V
V
V
= 12V  
= -7V  
= 12V  
= -7V  
= 12V  
= -7V  
80  
-50  
10  
-10  
10  
-10  
125  
-
CC  
IN  
IN  
IN  
IN  
IN  
IN  
-100  
-
Output Leakage Current (Y, Z) (Full  
Duplex Versions Only, Note 12)  
RE = 0V, DE = 0V,  
= 0V or 3.6V  
40  
-
IN3  
IN4  
V
CC  
-40  
-
Output Leakage Current (Y, Z)  
in Shutdown Mode (Full Duplex,  
Note 12)  
RE = V , DE = 0V,  
CC  
40  
-
V
= 0V or 3.6V  
CC  
-40  
Driver Short-Circuit Current,  
I
DE = V , -7V V or V 12V (Note 6)  
CC  
Full  
Full  
-
-200  
-
-
±250  
mA  
mV  
OSD1  
Y
Z
V
= High or Low  
O
Receiver Differential Threshold  
Voltage  
V
-7V V  
12V  
-125  
-50  
TH  
CM  
Receiver Input Hysteresis  
ΔV  
V
= 0V  
CM  
25  
15  
-
-
-
mV  
V
TH  
Receiver Output High Voltage  
V
I
= -4mA, V = -50mV  
ID  
Full  
V
- 0.6  
CC  
OH  
O
FN6307.2  
August 28, 2006  
5

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