Datasheet > ISD5116SERIES

ISD5116SERIES

更新时间： 2024-02-20 18:48:23

品牌	Logo	应用领域
其他 - ETC		存储
页数	文件大小	规格书
81页	2222K
描述
Single-Chip Voice Record/Playback Device with Digital Memory Capability

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技术参数
数据手册

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ISD5116SERIES 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Transferred	零件包装代码：	DIE
包装说明：	DIE,	针数：	27
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.1	应用：	ANSWERING MACHINE
商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG	JESD-30 代码：	R-XUUC-N27
JESD-609代码：	e0	功能数量：	1
端子数量：	27	片上内存类型：	FLASH
最高工作温度：	50 °C	最低工作温度：
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	RECTANGULAR	封装形式：	UNCASED CHIP
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
最长读取时间：	960 s	最大供电电压 (Vsup)：	3.3 V
最小供电电压 (Vsup)：	2.7 V	表面贴装：	YES
温度等级：	COMMERCIAL	端子面层：	TIN LEAD
端子形式：	NO LEAD	端子位置：	UPPER
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

ISD5116SERIES 数据手册

ISD5116

7.4.6. Ana Out Description ....................................................................................................... 34

7.4.7. Analog Inputs ................................................................................................................. 34

7.5. Digital Mode............................................................................................................................. 37

7.5.1. Erasing Data................................................................................................................... 37

7.5.2. Writing Data.................................................................................................................... 37

7.5.3. Reading Data ................................................................................................................. 38

7.5.4. Example Command Sequence ...................................................................................... 38

7.6. Pin Details................................................................................................................................ 49

7.6.1. Digital I/O Pins................................................................................................................ 49

7.6.2. Analog I/O Pins .............................................................................................................. 51

7.6.3. Power and Ground Pins................................................................................................. 55

7.6.4. Sample PC Layout ......................................................................................................... 55

8. TIMING DIAGRAMS.......................................................................................................................... 56

8.1. I²C Timing Diagram.................................................................................................................. 56

8.2. Playback and Stop Cycle......................................................................................................... 58

8.3. Example of Power-up Command (First 12 Bits) ...................................................................... 59

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 60

10. ELECTRICAL CHARACTERISTICS............................................................................................... 62

10.1. General Parameters .............................................................................................................. 62

10.2. Timing Parameters ................................................................................................................ 63

10.3. Analog Parameters................................................................................................................ 65

10.4. Characteristics of the I²C Serial Interface.............................................................................. 69

10.5. I²C Protocol............................................................................................................................ 72

11. TYPICAL APPLICATION CIRCUIT................................................................................................. 74

12. PACKAGE SPECIFICATION .......................................................................................................... 75

12.1. Plastic Thin Small Outline Package (TSOP) Type E Dimensions......................................... 75

12.2. Plastic Small Outline Intergrated Circuit (SOIC) Dimensions................................................ 76

12.3. Plastic Dual Inline Package (PDIP) Dimensions ................................................................... 77

12.4. Die Bonding Physical Layout................................................................................................. 78

13. ORDERING INFORMATION........................................................................................................... 80

14. VERSION HISTORY ....................................................................................................................... 81

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1...3 4 567 8 9...81

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与ISD5116SERIES相关器件

型号	品牌	描述	获取价格	数据表
ISD5116SI	WINBOND	Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Cap	获取价格
ISD5116SY	WINBOND	Speech Synthesizer With RCDG, 960s, CMOS, PDSO28, 0.300 MM INCH, LEAD FREE, PLASTIC, SOIC-	获取价格
ISD5116SY	NUVOTON	SINGLE-CHIP 1TO16 MINUTES DURATION VOICE RECORD/PLAYBAC VOICE DEVICES WITH DIGITAL STORAGE	获取价格
ISD5116SYI	WINBOND	Speech Synthesizer With RCDG, 960s, CMOS, PDSO28, 0.300 MM INCH, LEAD FREE, PLASTIC, SOIC-	获取价格
ISD5116SYI	NUVOTON	SINGLE-CHIP 1TO16 MINUTES DURATION VOICE RECORD/PLAYBAC VOICE DEVICES WITH DIGITAL STORAGE	获取价格
ISD5116X	WINBOND	Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Cap	获取价格

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