ISD1760PY01

更新时间： 2024-01-06 13:47:55

品牌	Logo	应用领域
华邦 - WINBOND		音频合成器集成电路消费电路
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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ISD1760PY01 技术参数

ISD1700 SERIES

13 VERSION HISTORY

VERSION

1.3-S

DATE

DESCRIPTION

Initial version

Sep 2006

Nov 2006

Jan 2007

1.3-S1

1.3-S2

Revise Pinout Configuration & Pin Description sections

Revise Rosc resistor value

Revise Selectable Message Duration section

Update standby current, sampling frequency & duration parameters

Publication Release Date: January 23, 2007

- 23 -

Revision 1.3-S2

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型号	品牌	获取价格	描述	数据表
ISD1760PYI	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760PYI01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760PYIR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760PYIR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760PYR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760PYR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760SY	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760SY01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760SYI	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760SYI01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices