ISD1760

更新时间： 2024-01-05 05:16:49

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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中文翻译

获取价格

技术参数
数据手册

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ISD1760 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	,	Reach Compliance Code：	compliant
风险等级：	5.09	湿度敏感等级：	3
Base Number Matches：	1

ISD1760 数据手册

ISD1700 SERIES

11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)

26 25

23 22 21 20 19 18 17

6 7

9 10 11 12 13 14

Plastic Small Outline Integrated Circuit (SOIC) Dimensions

INCHES

Nom

MILLIMETERS

Min

Max

0.711

0.104

0.299

0.0115

0.019

Min

17.81

2.46

Nom

17.93

2.56

7.52

0.22

0.41

1.27

10.31

0.81

Max

18.06

2.64

7.59

0.29

0.48

0.701

0.097

0.292

0.005

0.014

0.706

0.101

0.296

0.009

0.016

0.050

0.406

0.032

7.42

0.127

0.35

0.400

0.024

0.410

0.040

10.16

0.61

10.41

1.02

Lead coplanarity to be within 0.004 inches.

Note:

- 20 -

1...17 18 192021 22 23 24

中文翻译

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与ISD1760相关器件

型号	品牌	获取价格	描述	数据表
ISD1760A	WINBOND	获取价格	Multi-Message Single-Chip Voice Record&Playback Devices
ISD1760AX	WINBOND	获取价格	Speech Synthesizer With RCDG, 120s, DIE-28
ISD1760EY	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EY01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYI	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYI01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYIR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYIR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD1760EYR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices