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ISD17240SYI01 PDF预览

ISD17240SYI01

更新时间: 2024-01-23 09:38:21
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

ISD17240SYI01 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.55
Base Number Matches:1

ISD17240SYI01 数据手册

 浏览型号ISD17240SYI01的Datasheet PDF文件第17页浏览型号ISD17240SYI01的Datasheet PDF文件第18页浏览型号ISD17240SYI01的Datasheet PDF文件第19页浏览型号ISD17240SYI01的Datasheet PDF文件第21页浏览型号ISD17240SYI01的Datasheet PDF文件第22页浏览型号ISD17240SYI01的Datasheet PDF文件第23页 
ISD1700 SERIES  
11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)  
28  
26 25  
23 22 21 20 19 18 17  
15  
16  
27  
24  
1
2
3
4
5
6 7  
9 10 11 12 13 14  
8
A
G
C
B
D
F
E
H
Plastic Small Outline Integrated Circuit (SOIC) Dimensions  
INCHES  
Nom  
MILLIMETERS  
Min  
Max  
0.711  
0.104  
0.299  
0.0115  
0.019  
Min  
17.81  
2.46  
Nom  
17.93  
2.56  
7.52  
0.22  
0.41  
1.27  
10.31  
0.81  
Max  
18.06  
2.64  
7.59  
0.29  
0.48  
A
B
C
D
E
F
0.701  
0.097  
0.292  
0.005  
0.014  
0.706  
0.101  
0.296  
0.009  
0.016  
0.050  
0.406  
0.032  
7.42  
0.127  
0.35  
G
H
0.400  
0.024  
0.410  
0.040  
10.16  
0.61  
10.41  
1.02  
Lead coplanarity to be within 0.004 inches.  
Note:  
- 20 -  

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