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ISD17210PYIR01

更新时间： 2024-02-13 19:06:17

品牌	Logo	应用领域
华邦 - WINBOND		音频合成器集成电路消费电路
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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中文翻译

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技术参数
数据手册

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ISD17210PYIR01 技术参数

生命周期：	Transferred	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.7
Is Samacsys：	N	Base Number Matches：	1

ISD17210PYIR01 数据手册

ISD1700 SERIES

11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)

26 25

23 22 21 20 19 18 17

6 7

9 10 11 12 13 14

Plastic Small Outline Integrated Circuit (SOIC) Dimensions

INCHES

Nom

MILLIMETERS

Min

Max

0.711

0.104

0.299

0.0115

0.019

Min

17.81

2.46

Nom

17.93

2.56

7.52

0.22

0.41

1.27

10.31

0.81

Max

18.06

2.64

7.59

0.29

0.48

0.701

0.097

0.292

0.005

0.014

0.706

0.101

0.296

0.009

0.016

0.050

0.406

0.032

7.42

0.127

0.35

0.400

0.024

0.410

0.040

10.16

0.61

10.41

1.02

Lead coplanarity to be within 0.004 inches.

Note:

- 20 -

1...17 18 192021 22 23 24

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与ISD17210PYIR01相关器件

型号	品牌	获取价格	描述	数据表
ISD17210PYR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYI	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYI01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYIR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYIR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYR	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYR01	WINBOND	获取价格	Multi-Message Single-Chip Voice Record & Playback Devices