ISD17210

更新时间： 2024-01-28 07:24:29

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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ISD17210 技术参数

ISD1700 SERIES

13 VERSION HISTORY

VERSION

1.3-S

DATE

DESCRIPTION

Initial version

Sep 2006

Nov 2006

Jan 2007

1.3-S1

1.3-S2

Revise Pinout Configuration & Pin Description sections

Revise Rosc resistor value

Revise Selectable Message Duration section

Update standby current, sampling frequency & duration parameters

Publication Release Date: January 23, 2007

- 23 -

Revision 1.3-S2

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型号	品牌	描述	获取价格	数据表
ISD17210EY	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210EY01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210EYI	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210EYI01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210EYIR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17210EYIR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格