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ISD17150XYR01 PDF预览

ISD17150XYR01

更新时间： 2022-04-23 23:00:11
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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中文翻译

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ISD17150XYR01 数据手册

 浏览型号ISD17150XYR01的Datasheet PDF文件第15页浏览型号ISD17150XYR01的Datasheet PDF文件第16页浏览型号ISD17150XYR01的Datasheet PDF文件第17页浏览型号ISD17150XYR01的Datasheet PDF文件第19页浏览型号ISD17150XYR01的Datasheet PDF文件第20页浏览型号ISD17150XYR01的Datasheet PDF文件第21页 
ISD1700 SERIES  
Example #3: Connecting the SPI Interface to a microcontroller  
Reset  
3
2
24  
23  
25  
REC  
RESET  
PLAY  
ERASE  
0.1μF  
vAlert  
D1  
1 KΩ  
LED  
26  
FWD  
Vcc  
Gnd  
**  
VCCD  
**  
19  
22  
VCCA  
VCCD  
VCCP  
VOL  
FT  
1
VCCD  
VSSD  
0.1  
μ
F
*
28  
VCCA  
21  
8
VCCA  
VSSA  
7
6
*
μ
0.1  
F
SS  
VCCP  
SCLK  
MOSI  
MISO  
14  
16  
VCCP  
To uC  
SPI  
5
4
*
ISD1700  
*
VSSP1  
μ
0.1  
F
μ
0.1  
F
12  
VSSP2  
15  
13  
10  
11  
Speaker  
or Buzzer  
VCC  
SP+  
SP-  
MIC+  
MIC -  
Speaker  
AUD  
AUX  
17  
27  
0.1μF  
9
AUD/AUX  
INT/RDY  
8050C  
AnaIn  
VCCD  
100 KΩ  
Optional  
Rosc ***  
390  
Ω
20  
18  
F
ROSC  
AGC  
0.1μ F  
μ
4.7  
Optional: based upon the applications  
*** At 8kHz sampling freq, Rosc = 80 K  
: Digital ground;  
: Analog ground;  
: Ground for SP+;  
: Ground for SP-  
10.1  
GOOD AUDIO DESIGN PRACTICES  
To ensure the highest quality of voice reproduction, it is important to follow good audio design  
practices in layout and power supply decoupling. See recommendations from below links or other  
Application Notes in our websites.  
Design Considerations for ISD1700 Family  
AN-CC1002 Design Considerations for ISD1700 Family.pdf  
Good Audio Design Practices  
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf  
Single-Chip Board Layout Diagrams  
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf  
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