Datasheet > 消费电路 > 音频合成器集成电路> ISD1610BPI

ISD1610BPI

更新时间： 2024-01-09 21:17:05

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
23页	309K
描述
Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert Option

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

ISD1610BPI 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Contact Manufacturer	零件包装代码：	DIE
包装说明：	DIE,	针数：	16
Reach Compliance Code：	compliant	HTS代码：	8542.39.00.01
风险等级：	5.03	商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：	R-XUUC-N16	功能数量：	1
端子数量：	16	片上内存类型：	FLASH
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	RECTANGULAR	封装形式：	UNCASED CHIP
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
最长读取时间：	20 s	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2.4 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子位置：	UPPER	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

ISD1610BPI 数据手册

ISD1600B SERIES

10. TYPICAL APPLICATION CIRCUIT

The below example illustrates a typical applications of ISD1600B device.

LED

V_CCD

1 K Ω

R7*

LED

Vcc

***

V_CCD

V_CCP

Gnd

REC

V_CCD

V_CCA

C9*

0.1

***

V_SSD

V_CCA

PLAYE

PLAYL

4.7 K

C10*

Optional: based upon the

applications

4.7 K

0.1

V_SSA

Speaker

ISD1600B

V_CC

Electret

Microphone

V_CCP

V_SSP

MIC+

MIC -

C11*

0.1

0.1 F

8050

0.1

4.7

R4**

4.7 KΩ

AUD

R_OSC

AGC

390

SP+

SP-

0.1

Speaker

or Buzzer

4.7

Schematic shows both speaker and AUD outputs

Notes:

These components may be needed in order to optimize for the best voice quality and system performance,

which is also dependent upon the layout of the PCB. Pending upon system requirement, Cx can be 10 μF,

4.7 μF or other values. For R7, 1kΩ gives satisfactory result fro most cases.

** For Sampling Freq at 8 kHz, R4 = 80 KΩ

*** It is important to have a separate path for each ground and power back to related terminal to minimize the

noise. Also, the power supplies should be decoupled as close to the device as possible.

Good Audio Design Practices

Winbond’s ChipCorder are very high-quality single-chip voice recording and playback devices. To

ensure the highest quality voice reproduction, it is important that good audio design practices on

layout and power supply decoupling are followed. See Application Information links below for details.

Design considerations for ISD1600B Series

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationbriefs/AN-CC1001.pdf

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

Publication Release Date: Jan. 23, 2007

- 17 -

Revision 1.2

1...14 15 161718 19 20...23

下载PDF

与ISD1610BPI相关器件

型号	品牌	描述	获取价格	数据表
ISD1610BPI01	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格
ISD1610BPY	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格
ISD1610BPY01	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格
ISD1610BPYI	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格
ISD1610BPYI01	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格
ISD1610BS	WINBOND	Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O	获取价格

与ISD1610BPI相关文章

深入解析CS8416引脚说明、参数、技术特点
2024-06-03

1
TPA3116D2功放芯片参数详解、引脚说明
2024-06-03

1
移位寄存器74HC165引脚说明、驱动程序示例解读
2024-06-03

2
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
2024-06-03

2

产品中心

服务支持

精选活动

关于我们

帮助中心

ISD1610BPI

ISD1610BPI 技术参数

ISD1610BPI 数据手册

与ISD1610BPI相关器件

与ISD1610BPI相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ISD1610BPI

ISD1610BPI 技术参数

ISD1610BPI 数据手册

与ISD1610BPI相关器件

与ISD1610BPI相关文章

您还可以找

您在本页遇到什么问题？