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ISD1610BP PDF预览

ISD1610BP

更新时间: 2024-02-02 12:34:52
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
23页 309K
描述
Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert Option

ISD1610BP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Contact Manufacturer零件包装代码:DIE
包装说明:DIE,针数:16
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.03商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-XUUC-N16功能数量:1
端子数量:16片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最长读取时间:20 s最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

ISD1610BP 数据手册

 浏览型号ISD1610BP的Datasheet PDF文件第17页浏览型号ISD1610BP的Datasheet PDF文件第18页浏览型号ISD1610BP的Datasheet PDF文件第19页浏览型号ISD1610BP的Datasheet PDF文件第20页浏览型号ISD1610BP的Datasheet PDF文件第22页浏览型号ISD1610BP的Datasheet PDF文件第23页 
ISD1600B SERIES  
12. ORDERING INFORMATION  
Product Number Descriptor Key  
ISD16xxxxxxxx  
Product Series:  
Special Features Field:  
Blank = vAlert disabled  
01 = vAlert enabled  
Temperature:  
Industrial (-40°C to +85°C)  
Blank = Commerical  
ISD1600 Series  
Duration:  
10B : 6.6 – 20 secs  
I
=
12B : 8 – 24 secs  
16B : 10.6 – 30 secs  
20B : 13.3 – 40 secs  
Die (0°C to +50°C)  
Package (0°C to +70°C)  
Package Option:  
= Lead-free  
Blank = Leaded  
Y
Package Type:  
X
P
S
=
=
=
Die  
Plastic Dual Inline Package (PDIP)  
Small Outline Integrated Circuit (SOIC) Package  
When ordering, please refer to the following valid part numbers that are supported in volume for this  
product series. Contact the local Winbond Sales Representative or Distributor for availability  
information.  
For the latest product information, access Winbond’s worldwide website at  
http://www.winbond-usa.com  
Publication Release Date: Jan. 23, 2007  
- 21 -  
Revision 1.2  

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