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IRLI520 PDF预览

IRLI520

更新时间: 2024-09-29 22:23:47
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英飞凌 - INFINEON /
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2页 39K
描述
Power MOSFET

IRLI520 数据手册

 浏览型号IRLI520的Datasheet PDF文件第2页 
PD - 9.1496A  
IRLI520N  
PRELIMINARY  
HEXFET® Power MOSFET  
l Logic-Level Gate Drive  
l Advanced Process Technology  
l Isolated Package  
D
VDSS = 100V  
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l Fully Avalanche Rated  
RDS(on) = 0.18Ω  
G
ID =8.1A  
Description  
S
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedizeddevicedesignthatHEXFETPowerMOSFETs  
arewellknownfor,providesthedesignerwithanextremely  
efficient and reliable device for use in a wide variety of  
applications.  
The TO-220 Fullpak eliminates the need for additional  
insulatinghardwareincommercial-industrialapplications.  
The moulding compound used provides a high isolation  
capability and a low thermal resistance between the tab  
andexternalheatsink. Thisisolationisequivalenttousing  
a 100 micron mica barrier with standard TO-220 product.  
The Fullpak is mounted to a heatsink using a single clip or  
by a single screw fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current †  
8.1  
5.7  
A
35  
PD @TC = 25°C  
Power Dissipation  
30  
0.20  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 16  
Single Pulse Avalanche Energy‚†  
Avalanche Current†  
85  
mJ  
A
6.0  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
3.0  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
5.0  
65  
Units  
RθJC  
RθJA  
°C/W  
–––  
3/16/98  

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