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IRLI3303 PDF预览

IRLI3303

更新时间: 2024-09-28 21:53:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 155K
描述
HEXFET Power MOSFET

IRLI3303 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.84配置:Single
最大漏极电流 (Abs) (ID):25 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0工作模式:ENHANCEMENT MODE
最高工作温度:175 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):31 W子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
Base Number Matches:1

IRLI3303 数据手册

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PD - _____  
IRLI3303  
PRELIMINARY  
HEXFET® Power MOSFET  
Logic-Level Gate Drive  
Advanced Process Technology  
Isolated Package  
High Voltage Isolation = 2.5KVRMS  
Sink to Lead Creepage Dist. = 4.8mm  
Fully Avalanche Rated  
VDSS = 30V  
RDS(on) = 0.026Ω  
ID = 25A  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
known for, provides the designer with an extremely efficient  
device for use in a wide variety of applications.  
The TO-220 Fullpak eliminates the need for additional  
insulating hardware in commercial-industrial applications.  
The moulding compound used provides a high isolation  
capability and a low thermal resistance between the tab  
and external heatsink. This isolation is equivalent to using  
a 100 micron mica barrier with standard TO-220 product.  
The Fullpak is mounted to a heatsink using a single clip or  
by a single screw fixing.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
25  
18  
140  
A
PD @TC = 25°C  
Power Dissipation  
31  
W
W/°C  
V
Linear Derating Factor  
0.21  
±20  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current  
130  
mJ  
A
20  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Current  
Peak Diode Recovery dv/dt  
Operating Junction and  
5.6  
mJ  
V/ns  
2.6  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Min.  
––––  
––––  
Typ.  
––––  
––––  
Max.  
4.8  
Units  
RθJC  
RθJA  
65  
°C/W  
8/24/95  

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