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IRLI3615PBF

更新时间: 2024-09-29 03:36:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 166K
描述
HEXFET Power MOSFET

IRLI3615PBF 数据手册

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PD - 95596  
IRLI3615PbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS = 150V  
R
DS(on) = 0.085 Ω  
G
l Fully Avalanche Rated  
l Lead-Free  
ID = 14A  
S
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve extremely low on-resistance per silicon area.  
This benefit, combined with the fast switching speed and ruggedized device  
design that HEXFET Power MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable device for use in a wide variety  
of applications.  
The TO-220 Fullpak eliminates the need for additional insulating hardware in  
commercial-industrial applications. The moulding compound used provides a  
high isolation capability and a low thermal resistance between the tab and  
external heatsink. This isolation is equivalent to using a 100 micron mica barrier  
with standard TO-220 product. The Fullpak is mounted to a heatsink using a  
single clip or by a single screw fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
14 ꢀ  
9.8  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
56  
PD @TC = 25°C  
Power Dissipation  
45  
W
W/°C  
V
Linear Derating Factor  
0.30  
±16  
340  
8.4  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
4.5  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
3.3  
65  
Units  
RθJC  
RθJA  
°C/W  
–––  
www.irf.com  
1
07/23/04  

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