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IP4254CZ12 PDF预览

IP4254CZ12

更新时间: 2024-01-16 08:02:58
品牌 Logo 应用领域
恩智浦 - NXP 无源滤波器
页数 文件大小 规格书
10页 60K
描述
Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4

IP4254CZ12 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.77
其他特性:PI-TYPE CIRCUIT认证:IEC
电容:45 µF最大直流电阻:120 Ω
滤波器类型:DATA LINE FILTER高度:0.5 mm
长度:2.55 mm安装类型:SURFACE MOUNT
功能数量:6端子数量:12
最高工作温度:85 °C最低工作温度:-40 °C
包装材料:PLASTIC物理尺寸:L2.55XB1.4XH0.5 (mm)/L0.1XB0.055XH0.02 (inch)
子类别:Data Line Filters宽度:1.4 mm
Base Number Matches:1

IP4254CZ12 数据手册

 浏览型号IP4254CZ12的Datasheet PDF文件第1页浏览型号IP4254CZ12的Datasheet PDF文件第2页浏览型号IP4254CZ12的Datasheet PDF文件第4页浏览型号IP4254CZ12的Datasheet PDF文件第5页浏览型号IP4254CZ12的Datasheet PDF文件第6页浏览型号IP4254CZ12的Datasheet PDF文件第7页 
IP425xCZ8/CZ12/CZ16  
NXP Semiconductors  
Integrated 4-, 6- and 8-channel passive filter network  
3. Ordering information  
Table 2.  
Ordering information  
Type number Package  
Name  
Description  
Version  
IP4253CZ8-4 HXSON8  
plastic thermal enhanced extremely thin small outline package; no leads;  
8 terminals; body 1.35 × 1.7 × 0.5 mm  
SOT983-1  
SOT984-1  
SOT985-1  
SOT983-1  
SOT984-1  
SOT985-1  
IP4253CZ12-6 HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;  
12 terminals; body 1.35 × 2.5 × 0.5 mm  
IP4253CZ16-8 HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;  
16 terminals; body 1.35 × 3.3 × 0.5 mm  
IP4254CZ8-4 HXSON8  
plastic thermal enhanced extremely thin small outline package; no leads;  
8 terminals; body 1.35 × 1.7 × 0.5 mm  
IP4254CZ12-6 HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;  
12 terminals; body 1.35 × 2.5 × 0.5 mm  
IP4254CZ16-8 HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;  
16 terminals; body 1.35 × 3.3 × 0.5 mm  
4. Limiting values  
Table 3.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
Max  
Unit  
VCC  
Vesd  
supply voltage  
0.5  
+5.6  
V
electrostatic discharge  
voltage  
all pins to ground  
contact discharge  
air discharge  
[1]  
[1]  
30  
30  
+30  
+30  
kV  
kV  
IEC 61000-4-2, Level 4;  
all pins to ground  
contact discharge  
air discharge  
8  
15  
-
+8  
kV  
+15  
60  
kV  
Pch  
channel power dissipation Tamb = 85 °C  
mW  
mW  
°C  
Ptot  
total power dissipation  
storage temperature  
ambient temperature  
Tamb = 85 °C  
-
200  
+150  
+85  
Tstg  
Tamb  
55  
40  
°C  
[1] Device withstands 1000 discharges with ±30 kV using the IEC 61000-4-2 model without degradation.  
5. Thermal characteristics  
Table 4.  
Symbol Parameter  
Rth(j-pcb) thermal resistance from junction to 2 layer printed-circuit  
printed-circuit board board  
Thermal characteristics  
Conditions  
Typ  
120[1]  
Unit  
K/W  
[1] Depends on layout details.  
IP4253_54_CZ8_CZ12_CZ16_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
3 of 10  

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