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IHLP1212BZER3R3M11 PDF预览

IHLP1212BZER3R3M11

更新时间: 2024-01-20 08:44:35
品牌 Logo 应用领域
威世 - VISHAY 电感器
页数 文件大小 规格书
5页 198K
描述
Low Profile, High Current IHLP® Inductors

IHLP1212BZER3R3M11 技术参数

生命周期:Active包装说明:1212
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:1.17
大小写代码:1212构造:Rectangular
型芯材料:COMPOSITE直流电阻:0.061 Ω
标称电感 (L):3.3 µH电感器应用:HIGH CURRENT INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e3
功能数量:1端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装高度:2 mm封装长度:3 mm
封装形式:SMT封装宽度:3 mm
包装方法:TR, 13 Inch最大额定电流:2.7 A
自谐振频率:45 MHz形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:YES表面贴装:YES
端子面层:Tin (Sn)端子位置:DUAL ENDED
端子形状:WRAPAROUND测试频率:0.1 MHz
容差:20%Base Number Matches:1

IHLP1212BZER3R3M11 数据手册

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IHLP-1212BZ-11  
www.vishay.com  
Vishay Dale  
Low Profile, High Current IHLP® Inductors  
FEATURES  
• Shielded construction  
• Excellent DC/DC energy storage up to 1 MHz to  
2 MHz. Filter inductor applications up to SFR  
(see table below)  
• Lowest DCR/μH, in this package size  
• Handles high transient current spikes without  
saturation  
• Ultra low buzz noise, due to composite construction  
Manufactured under one or more of the following:  
US Patents; 6,198,375/6,204,744/6,449,829/6,460,244.  
Several foreign patents, and other patents pending.  
• Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
APPLICATIONS  
STANDARD ELECTRICAL SPECIFICATIONS  
• PDA/notebook/desktop/server applications  
• High current POL converters  
L0  
INDUCTANCE  
20 ꢀ AT  
100 kHz,  
0.25 V, 0 A  
(μH)  
HEAT  
• Low profile, high current power supplies  
• Battery powered devices  
DCR DCR RATING SATURATION  
TYP. MAX. CURRENT CURRENT  
25 °C 25 °C DC TYP.  
SFR  
TYP.  
(MHz)  
DC TYP.  
• DC/DC converters in distributed power systems  
(m) (m)  
9.5 11.4  
11.5 13.8  
16.2 19.4  
17.0 20.4  
18.5 22.0  
20.0 24.0  
23.0 27.0  
28.5 32.0  
42.9 46.0  
56.0 61.0  
(A) (3)  
6.5  
6.3  
5.5  
5.5  
5.5  
5.0  
5.0  
3.8  
3.0  
2.7  
(A) (4)  
• DC/DC converter for Field Programmable Gate Array  
(FPGA)  
0.22  
0.36  
0.56  
0.68  
0.88  
1.0  
7.5  
6.5  
5.5  
5.0  
4.5  
4.5  
4.0  
4.0  
3.3  
3.3  
245  
170  
110  
105  
85  
• Currently not recommended for automotive applications  
DIMENSIONS in inches [millimeters]  
75  
1.2  
65  
1.5  
70  
0.118 0.008  
[3.0 0.ꢀꢁ  
0.0ꢀ0 0.008  
[0.5 0.ꢀꢁ  
2.2  
55  
3.3  
45  
Typical Pad Layout  
0.14ꢀ [3.6ꢁ  
Max.  
Notes  
0.165  
[4.ꢀꢁ  
(1)  
All test data is referenced to 25 °C ambient  
Operating temperature range - 55 °C to + 125 °C  
(2)  
(3)  
(4)  
(5)  
0.047  
[1.ꢀꢁ  
DC current (A) that will cause an approximate T of 40 °C  
DC current (A) that will cause L0 to drop approximately 20 %  
The part temperature (ambient + temp. rise) should not exceed  
125 °C under worst case operating conditions. Circuit design,  
component placement, PWB trace size and thickness, airflow  
and other cooling provisions all affect the part temperature. Part  
temperature should be verified in the end application.  
0.079 [ꢀ.0ꢁ  
Max.  
0.047  
[1.ꢀꢁ  
0.031 0.01ꢀ  
[0.8 0.3ꢁ  
DESCRIPTION  
IHLP-1212BZ-11  
0.22 μH  
20 ꢀ  
ER  
e3  
JEDEC LEAD (Pb)-FREE STANDARD  
MODEL  
INDUCTANCE VALUE  
INDUCTANCE TOLERANCE  
PACKAGE CODE  
GLOBAL PART NUMBER  
I
H
L
P
1
2
1
2
B
Z
E
R
R
2
2
M
1
1
PRODUCT FAMILY  
SIZE  
PACKAGE  
CODE  
INDUCTANCE  
VALUE  
TOL.  
SERIES  
Revision: 16-Jul-13  
Document Number: 34289  
1
For technical questions, contact: magnetics@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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