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IDT71V67703S80PFI8 PDF预览

IDT71V67703S80PFI8

更新时间: 2024-02-23 04:22:06
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
20页 174K
描述
Cache SRAM, 256KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100

IDT71V67703S80PFI8 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.24最长访问时间:8 ns
其他特性:FLOW-THROUGH ARCHITECTURE最大时钟频率 (fCLK):87 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:100
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.07 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.23 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:20
宽度:14 mmBase Number Matches:1

IDT71V67703S80PFI8 数据手册

 浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第1页浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第3页浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第4页浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第5页浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第6页浏览型号IDT71V67703S80PFI8的Datasheet PDF文件第7页 
IDT71V67703, IDT71V67903, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with  
3.3V I/O, Flow-Through Outputs, Single Cycle Deselect  
Commercial and Industrial Temperature Ranges  
Description  
initiating the access sequence. The first cycle of output data will flow-  
through from the array after a clock-to-data access time delay from the  
risingclockedgeofthesamecycle. Ifburstmodeoperationisselected  
(ADV=LOW),thesubsequentthreecyclesofoutputdatawillbeavailable  
totheuseronthenextthreerisingclockedges. Theorderofthesethree  
addressesaredefinedbytheinternalburstcounterandtheLBOinputpin.  
TheIDT71V67703/7903SRAMsutilizeIDT’slatesthigh-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pin thinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and a 165 fine pitch ball grid array (fBGA).  
TheIDT71V67703/7903arehigh-speedSRAMsorganizedas256K  
x 36/512K x 18. The IDT71V67703/7903 SRAMs contain write, data,  
addressandcontrolregisters. Therearenoregistersinthedataoutput  
path (flow-through architecture). Internal logic allows the SRAM to  
generateaself-timedwritebaseduponadecisionwhichcanbeleftuntil  
theendofthewritecycle.  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V67703/7903canprovidefourcyclesof  
data for a single address presented to the SRAM. An internal burst  
address counter accepts the first cycle address from the processor,  
PinDescriptionSummary  
A
0-A18  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
Chip Enable  
CE  
CS  
0
, CS  
1
Chip Selects  
Output Enable  
OE  
GW  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
BWE  
BW , BW  
1
2
, BW  
3
, BW (1)  
4
CLK  
Clock  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
N/A  
Synchronous  
Synchronous  
Synchronous  
DC  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Sleep Mode  
ADV  
ADSC  
ADSP  
LBO  
ZZ  
Asynchronous  
Synchronous  
N/A  
I/O  
0-I/O31, I/OP1-I/OP4  
Data Input / Output  
V
V
DD, VDDQ  
SS  
Core Power, I/O Power  
Ground  
Supply  
Supply  
N/A  
5309 tbl 01  
NOTE:  
1. BW3 and BW4 are not applicable for the IDT71V67903.  
6.422  

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