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IDT71V67703S80BQGI PDF预览

IDT71V67703S80BQGI

更新时间: 2024-02-23 00:27:06
品牌 Logo 应用领域
艾迪悌 - IDT 计数器静态存储器
页数 文件大小 规格书
23页 976K
描述
Cache SRAM, 256KX36, 8ns, CMOS, PBGA165, 13 X 15 MM, GREEN, FBGA-165

IDT71V67703S80BQGI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.24最长访问时间:8 ns
其他特性:FLOW-THROUGH ARCHITECTURE最大时钟频率 (fCLK):100 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:100
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.07 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.23 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:20
宽度:14 mmBase Number Matches:1

IDT71V67703S80BQGI 数据手册

 浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第1页浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第3页浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第4页浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第5页浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第6页浏览型号IDT71V67703S80BQGI的Datasheet PDF文件第7页 
IDT71V67703, IDT71V67903, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with  
3.3V I/O, Flow-Through Outputs, Single Cycle Deselect  
Commercial and Industrial Temperature Ranges  
PinDefinitions(1)  
Symbol  
Pin Function  
I/O  
Active  
Description  
A0-A18  
Address Inputs  
I
N/A  
Synchronous Address inputs. The address register is triggered by a combi-nation of the  
rising edge of CLK and ADSC Low or ADSP Low and CE Low.  
Address Status  
(Cache Controller)  
I
I
I
LOW  
LOW  
LOW  
Synchronous Address Status from Cache Controller. ADSC is an active LOW input that is  
used to load the address registers with new addresses.  
ADSC  
ADSP  
ADV  
Address Status  
(Processor)  
Synchronous Address Status from Processor. ADSP is an active LOW input that is used to  
load the address registers with new addresses.  
is gated by  
.
CE  
ADSP  
Burst Address  
Advance  
Synchronous Address Advance. ADV is an active LOW input that is used to advance the  
internal burst counter, controlling burst access after the initial address is loaded. When the  
input is HIGH the burst counter is not incremented; that is, there is no address advance.  
Byte Write Enable  
I
LOW  
Synchronous byte write enable gates the byte write inputs BW1-BW4. If BWE is LOW at the  
rising edge of CLK then BWx inputs are passed to the next stage in the circuit. If BWE is  
HIGH then the byte write inputs are blocked and only GW can initiate a write cycle.  
BWE  
Individual Byte  
Write Enables  
I
I
I
LOW  
LOW  
N/A  
Synchronous byte write enables. BW1 controls I/O0-7, I/OP1, BW2 controls I/O8-15, I/OP2, etc.  
Any active byte write causes all outputs to be disabled.  
BW1-BW4  
CE  
Chip Enable  
Synchronous chip enable. CE is used with CS0 and CS1 to enable the IDT71V67703/7903.  
CE also gates ADSP.  
CLK  
Clock  
This is the clock input. All timing references for the device are made with respect to this  
input.  
CS0  
CS1  
GW  
Chip Select 0  
Chip Select 1  
I
I
I
HIGH  
LOW  
LOW  
Synchronous active HIGH chip select. CS0 is used with CE and CS1 to enable the chip.  
Synchronous active LOW chip select. CS1 is used with CE and CS0 to enable the chip.  
Global Write  
Enable  
Synchronous global write enable. This input will write all four 9-bit data bytes when LOW  
on the rising edge of CLK. GW supersedes individual byte write enables.  
I/O0-I/O31  
I/OP1-I/OP4  
Data Input/Output  
I/O  
I
N/A  
Synchronous data input/output (I/O) pins. The data input path is registered, triggered by  
the rising edge of CLK. The data output path is flow-through (no output register).  
Linear Burst Order  
LOW  
Asynchronous burst order selection input. When LBO is HIGH, the inter-leaved burst  
sequence is selected. When LBO is LOW the Linear burst sequence is selected. LBO is a  
static input and must not change state while the device is operating.  
LBO  
Output Enable  
I
LOW  
Asynchronous output enable. When OE is LOW the data output drivers are enabled on the  
I/O pins if the chip is also selected. When OE is HIGH the I/O pins are in a high-  
impedance state.  
OE  
VDD  
VDDQ  
VSS  
NC  
Power Supply  
Power Supply  
Ground  
N/A  
N/A  
N/A  
N/A  
1
N/A  
N/A  
3.3V core power supply.  
3.3V I/O Supply.  
N/A  
Ground.  
No Connect  
Sleep Mode  
N/A  
NC pins are not electrically connected to the device.  
ZZ  
HIGH  
Asynchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down  
the IDT71V67703/7903 to its lowest power consumption level. Data retention is guaranteed  
in Sleep Mode.  
5309 tbl 02  
NOTE:  
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.  
6.422  

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