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IDT7007S55GB8 PDF预览

IDT7007S55GB8

更新时间: 2024-01-28 02:54:21
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
21页 164K
描述
Multi-Port SRAM, 32KX8, 55ns, CMOS, CPGA68

IDT7007S55GB8 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:PGA, PGA68,11X11
Reach Compliance Code:not_compliant风险等级:5.22
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:S-XPGA-P68JESD-609代码:e0
内存密度:262144 bit内存集成电路类型:MULTI-PORT SRAM
内存宽度:8端口数量:2
端子数量:68字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:32KX8输出特性:3-STATE
封装主体材料:CERAMIC封装代码:PGA
封装等效代码:PGA68,11X11封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:5 V
认证状态:Not Qualified筛选级别:38535Q/M;38534H;883B
最大待机电流:0.03 A最小待机电流:4.5 V
子类别:SRAMs最大压摆率:0.31 mA
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:PIN/PEG
端子节距:2.54 mm端子位置:PERPENDICULAR
处于峰值回流温度下的最长时间:30Base Number Matches:1

IDT7007S55GB8 数据手册

 浏览型号IDT7007S55GB8的Datasheet PDF文件第2页浏览型号IDT7007S55GB8的Datasheet PDF文件第3页浏览型号IDT7007S55GB8的Datasheet PDF文件第4页浏览型号IDT7007S55GB8的Datasheet PDF文件第6页浏览型号IDT7007S55GB8的Datasheet PDF文件第7页浏览型号IDT7007S55GB8的Datasheet PDF文件第8页 
IDT7007S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Military, Industrial and Commercial Temperature Ranges  
Truth Table I: Non-Contention Read/Write Control  
Inputs(1)  
R/W  
Outputs  
I/O0-7  
Mode  
CE  
H
L
OE  
X
X
L
SEM  
H
X
L
High-Z  
DATAIN  
Deselected: Power-Down  
Write to Memory  
H
L
H
X
H
DATAOUT Read Memory  
High-Z Outputs Disabled  
X
H
X
2940 tbl 02  
NOTE:  
1. A0L A14L A0R A14R  
Truth Table II: Semaphore Read/Write Control(1)  
Inputs  
Outputs  
R/W  
I/O0-7  
Mode  
-I/O  
CE  
OE  
SEM  
H
H
L
L
DATAOUT Read Semaphore Flag Data Out (I/O  
0
7)  
H
L
X
X
L
L
DATAIN  
Write I/O  
0 into Semaphore Flag  
______  
X
Not Allowed  
2940 tbl 03  
NOTE:  
1. There are eight semaphore flags written to via I/O0 and read from all I/O's. These eight semaphores are addressed by A0 - A2.  
AbsoluteMaximumRatings(1)  
MaximumOperatingTemperature  
andSupplyVoltage(1)  
Symbol  
Rating  
Commercial  
& Industrial  
Military  
Unit  
Ambient  
(2)  
Grade  
Temperature  
-55OC to+125OC  
0OC to +70OC  
-40OC to +85OC  
GND  
0V  
Vcc  
V
TERM  
Terminal Voltage  
with Respect  
to GND  
-0.5 to +7.0  
-0.5 to +7.0  
V
Military  
5.0V  
+
+
+
10%  
10%  
Te mp e rature  
Under Bias  
-55 to +125  
-65 to +150  
50  
-65 to +135  
-65 to +150  
50  
oC  
oC  
Commercial  
Industrial  
0V  
5.0V  
5.0V  
T
BIAS  
0V  
10%  
Storage  
Te mp e rature  
TSTG  
2940 tbl 05  
NOTES:  
1. This is the parameter TA. This is the "instant on" case temperature.  
IOUT  
DC Output  
Current  
mA  
2940 tbl 04  
NOTES:  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM  
RATINGS  
RecommendedDCOperating  
Conditions  
may cause permanent damage to the device. This is a stress rating only and  
functional operation of the device at these or any other conditions above those  
indicated in the operational sec-tions of this specification is not implied. Exposure  
to absolute maxi-mum rating conditions for extended periods may affect  
reliability.  
Symbol  
Parameter  
Supply Voltage  
GND Ground  
Min.  
Typ.  
Max. Unit  
VCC  
4.5  
5.0  
5.5  
0
V
V
V
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns  
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.  
0
0
(2)  
____  
V
IH  
Input High Voltage  
Input Low Voltage  
2.2  
6.0  
Capacitance(TA = +25°C, f = 1.0Mhz)  
VIL  
-0.5(1)  
0.8  
V
____  
Symbol  
Parameter(1)  
Input Capacitance  
Output Capacitance  
Conditions(2)  
Max.  
Unit  
2940 tbl 06  
NOTES:  
CIN  
VIN = 3dV  
9
pF  
1. VIL > -1.5V for pulse width less than 10ns.  
2. VTERM must not exceed Vcc + 10%.  
COUT  
VOUT = 3dV  
10  
pF  
2940 tbl 07  
NOTES:  
1. This parameter is determined by device characterization but is not production  
tested. TQFP package only.  
2. 3dV represents the interpolated capacitance when the input and output signals  
switch from 0V to 3V or from 3V to 0V.  
5

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