ICM7211AM
Absolute Maximum Ratings
Thermal Information
Supply Voltage (V
Input Voltage (Any Terminal) (Note 1) . . .V - 0.3V to V , + 0.3V
- V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
SS
Thermal Resistance (Typical, Note 2)
θJA (°C/W)
DD
SS DD
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60
70
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . .-65×°C to 150°C
Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300°C
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
*Pb-free PDIPs can be used for through hole wave solder process-
ing only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than V
or less than V may cause
SS
DD
destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same power supply be
applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211AM be turned on first.
2. θ is measured with the component mounted on an evaluation PC board in free air.
JA
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CHARACTERISTICS V
= 5V ±10%, T = 25°C, V = 0V Unless Otherwise Specified
DD
A
SS
Operating Supply Voltage Range (V
- V ), V
SS
3
-
-
-
-
-
-
5
6
V
µA
µA
µs
DD
SUPPLY
Operating Current, I
Test circuit, Display blank
Pin 36
10
50
DD
Oscillator Input Current, I
±2
±10
OSCI
Segment Rise/Fall Time, t , t
C
C
= 200pF
0.5
1.5
19
-
-
-
-
r
f
L
Backplane Rise/Fall Time, t , t
= 5000pF
µs
r
f
L
Oscillator Frequency, f
Pin 36 Floating
Pin 36 Floating
kHz
Hz
OSC
Backplane Frequency, f
150
BP
INPUT CHARACTERISTICS
Logical “1” Input Voltage, V
Logical “0” Input Voltage, V
4
-
-
-
-
1
V
IH
V
IL
Input Leakage Current, I
Pins 27-34
-
±0.01
5
±1
-
µA
pF
µA
pF
ILK
Input Capacitance, C
Pins 27-34
-
lN
BP/Brightness Input Leakage, I
Measured at Pin 5 with Pin 36 at V
All Devices
-
±0.01
200
±1
-
BPLK
SS
BP/Brightness Input Capacitance, C
-
BPI
AC CHARACTERISTICS
Chip Select Active Pulse Width, t
Other Chip Select Either Held Active, or
Both Driven Together
200
-
-
ns
WL
Data Setup Time, t
100
10
2
-
0
-
-
-
-
ns
ns
µs
DS
Data Hold Time, t
DH
Inter-Chip Select Time, t
ICS
FN3158.7
April 17, 2006
3
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