Datasheet > IC-553-1-MF

IC-553-1-MF

更新时间： 2024-01-11 00:36:39

品牌	Logo	应用领域
YAMAICHI		/
页数	文件大小	规格书
1页	37K
描述
Dual InlineMemoryModule (DIMM, 160 pins)

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中文翻译

获取价格

技术参数
数据手册

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IC-553-1-MF 技术参数

生命周期：	Contact Manufacturer	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.69	Base Number Matches：	1

IC-553-1-MF 数据手册

IC553 Series

Dual Inline Memory Module (DIMM, 160 pins)

Specifications

Part Number(Details)

1,000M min. at 500V DC

Insulation Resistance:

IC-553

Series No.

Dielectric Withstanding Voltage: 700V AC for 1 minute

Contact Resistance:

Operating Temperature Range: –55°C to +170°C

30m max. at 10mA/20mV max.

Mating Cycles:

Pin Count:

10,000 insertions min.

160 contact pins

Design No.

MF = Flanged

Unmarked = Not Flanged

Materials and Finish

Housing: Polyetherimide (PEI), glass-filled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

Features

í Card thickness 1.57mm

Outline Socket Dimensions

Recommended PC Board Layout

Top View from Socket

141.00 0.1

102.87 0.1

102.87 0.2

1.27x37=46.99 0.2 1.27x41=52.07 0.2

1.27x41=52.07 0.1

1.27x37=46.99 0.1

1.27 0.05

Æ3.20 Thru hole

160-Æ0.80 ^{+ 0.1}

3.81 Ref

2.54

(3.81)

1.27 0.1

1.27 0.05

+ 0.2

Æ3.20 ^{+ 0.1}

108.00

132.00 0.4

141.00 0.2

150.00 0.4

Matching Module Dimensions

110.50 ^{+ 0.2}

1.88 0.05

+ 0

0.1

1.50

R 0.75

w0.40 x t0.30

3.70 0.5

1.57

46.99

52.07

0.15

102.87

104.65 Ref

+ 0.26

110.24 ^{– 0.25}

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

Test & Burn-In B-3

中文翻译

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