IC589 Series
Dual Inline Memory Module (DIMM, 184 pins)
Specifications
Part Number(Details)
W
1,000M min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
-
-
1 MF
Insulation Resistance:
IC-589
Series No.
W
Contact Resistance:
30m max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Design No.
Mating Cycles:
Pin Count:
10,000 insertions minimum
184 contact pins
MF = Flanged
Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í Card thickness 1.27mm
í For 184 contact pins with 1.27mm pitch
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
162.70 0.1
120.65 0.1
120.65 0.2
1.27x51=64.77 0.2
1.27x39=49.53 0.2
1.27x39=49.53 0.1
1.27x51=64.77 0.1
1.27 0.05
6.35 ref.
184-Æ0.80 + 0.1
6.35
Æ3.20 Thru hole
0
Thru hole
1.27 0.15
1.27 0.15
1.27 0.05
129.50 + 0.2
Æ3.20 + 0.1
Thru hole
0
0
153.70 0.4
162.70 0.2
171.70 0.4
Matching Module Dimensions
153.70 ref
128.00 ref
1.27
4.00
1.80
1.27x39=49.53 0.1
3.00
1.27x51=64.77 0.1
W0.40 x t0.30
3.70 0.5
6.35
120.65
133.35
B-6 Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER