Datasheet > IC-554-1-MF

IC-554-1-MF

更新时间： 2024-01-17 21:01:39

品牌	Logo	应用领域
YAMAICHI		/
页数	文件大小	规格书
1页	43K
描述
Dual InlineMemoryModule (DIMM, 72 pins)

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中文翻译

获取价格

技术参数
数据手册

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IC-554-1-MF 技术参数

生命周期：	Contact Manufacturer	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.69	Base Number Matches：	1

IC-554-1-MF 数据手册

IC554 Series

Dual Inline Memory Module (DIMM, 72 pins)

Specifications

Part Number(Details)

1,000M min. at 500V DC

Insulation Resistance:

IC-554

Series No.

Dielectric Withstanding Voltage: 700V AC for 1 minute

Contact Resistance:

30m max. at 10mA/20mV max.

Operating Temperature Range: –55°C to +170°C

Mating Cycles:

Pin Count:

10,000 insertions min.

72 contact pins

1 = 72 Pins

MF = Flanged

Unmarked = Not Flanged

Materials and Finish

Housing:

Contacts:

Plating:

Polyetherimide (PEI), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

Features

í Card thickness 1.00mm

Outline Socket Dimensions

Recommended PC Board Layout

Top View from Socket

89.00 0.1

89.00 0.2

1.27x35=44.45 0.1

1.27x35=44.45 0.2

R 1.50

(1.27x17=21.59)

1.27 0.05

(1.27x18=22.86)

0.1

Æ3.20⁺

1.27x17=21.59 Ref 1.27x18=22.86 Ref

1.27 0.1

72-Æ0.80 ⁺

0.1

0.635 0.05

Æ3.20

Thru hole

1.27 0.05

0.67^{+ 0.1}

1.27 0.1

1.27x35=44.45 0.05

1.27x 35=44.45 0.2

80.00 0.4

98.00 0.4

80.00 Ref

+ 0.1

59.89

55.90 Ref

Matching Module Dimensions

Front

59.69

Front

w0.40 x t0.30

3.70 0.5

1.02 0.3

1.00⁺^–⁰⁰^.^.⁰⁰⁹⁷

1.27 0.3

7.62

44.45 0.05

54.00 ^{+ 0.2}

51.66

1.27x35=44.45 0.05

Back

(1.27x17=21.59)

2.00

(1.27x18=22.86)

Æ1.80 0.05

Back

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

Test & Burn-In

中文翻译

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