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IBM25PPC750GXEAB1032T PDF预览

IBM25PPC750GXEAB1032T

更新时间: 2023-01-03 07:08:35
品牌 Logo 应用领域
国际商业机器公司 - IBM /
页数 文件大小 规格书
74页 1054K
描述
RISC Microprocessor, 32-Bit, 733MHz, CMOS, CBGA292, 21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292

IBM25PPC750GXEAB1032T 数据手册

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Datasheet  
IBM PowerPC 750GX RISC Microprocessor  
DD1.X  
List of Figures ................................................................................................................ 5  
List of Tables .................................................................................................................. 7  
1. General Information .................................................................................................... 9  
1.1 Features ............................................................................................................................................ 9  
1.2 Design Highlights ............................................................................................................................ 11  
1.3 Processor Version Register ............................................................................................................ 11  
1.4 Part Number Information ................................................................................................................. 12  
2. Overview .................................................................................................................... 13  
2.1 Block Diagram ................................................................................................................................. 13  
2.2 General Parameters ........................................................................................................................ 14  
3. Electrical and Thermal Characteristics ................................................................... 15  
3.1 DC Electrical Characteristics ........................................................................................................... 15  
3.2 AC Electrical Characteristics ........................................................................................................... 17  
3.3 Clock AC Specifications .................................................................................................................. 18  
3.4 Spread Spectrum Clock Generator ................................................................................................. 19  
3.4.1 Design Considerations .......................................................................................................... 19  
3.5 60x Bus Input AC Specifications ..................................................................................................... 20  
3.5.1 Input Setup Timing ................................................................................................................ 20  
3.6 60x Bus Output AC Specifications .................................................................................................. 23  
3.6.1 IEEE 1149.1 AC Timing Specifications ................................................................................. 26  
4. Dimensions and Signal Assignments ..................................................................... 29  
4.1 Package .......................................................................................................................................... 29  
4.1.1 Reduced-Lead package ........................................................................................................ 29  
4.1.1.1 Mechanical Specifications .............................................................................................. 29  
4.1.1.2 Assembly Considerations ............................................................................................... 29  
4.1.1.3 Board Layout Considerations ......................................................................................... 30  
4.2 Module Substrate Decoupling Voltage Assignments ...................................................................... 35  
4.3 Microprocessor Ball Placement ....................................................................................................... 36  
4.4 Pinout Listings ................................................................................................................................. 37  
5. System Design Information ..................................................................................... 46  
5.1 Core Voltage Operation .................................................................................................................. 46  
5.2 Low Voltage Operation at Lower Frequency ................................................................................... 46  
5.2.1 Overview ................................................................................................................................ 46  
5.2.2 Restrictions and Considerations for PLL Configuration ......................................................... 47  
5.2.2.1 Configuration Restriction on Frequency Transitions ...................................................... 47  
5.2.3 PLL_RNG[0:1] Definitions for Dual PLL Operation ................................................................ 48  
5.2.4 PLL Configuration .................................................................................................................. 48  
5.3 PLL Power Supply Filtering ............................................................................................................. 50  
5.4 Decoupling Recommendations ....................................................................................................... 52  
5.5 Connection Recommendations ....................................................................................................... 54  
750GX_dsTOC.fm SA14-2765-02  
September 2, 2005  
Page 3 of 73  

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