Datasheet
DD 1.X
Preliminary
PowerPC 750GL RISC Microprocessor
Figure 2-1. IBM PowerPC 750GL RISC Microprocessor Block Diagram ................................................. 13
Figure 3-1. SYSCLK Input Timing Diagram .............................................................................................. 19
Figure 3-2. Linear Sweep Modulation Profile ........................................................................................... 20
Figure 3-3. Input Timing Definition ........................................................................................................... 22
Figure 3-4. Input Timing Diagram ............................................................................................................. 22
Figure 3-5. Mode Select Input Timing Diagram ........................................................................................ 23
Figure 3-6. Output Valid Timing Definition ................................................................................................ 25
Figure 3-7. Output Timing Diagram for IBM PowerPC 750GL RISC Microprocessor .............................. 26
Figure 3-8. JTAG Clock Input Timing Diagram ......................................................................................... 28
Figure 3-9. TRST Timing Diagram ........................................................................................................... 28
Figure 3-10. Boundary-Scan Timing Diagram ............................................................................................ 28
Figure 3-11. Test Access Port Timing Diagram .......................................................................................... 29
Figure 4-1. Mechanical Dimensions, Standard (Leaded) Package .......................................................... 31
Figure 4-2. Mechanical Dimensions, ROHS-Compatible Package .......................................................... 33
Figure 4-3. Module Substrate Decoupling Voltage Assignments ............................................................. 35
Figure 4-4. PowerPC 750GL Microprocessor Ball Placement .................................................................. 36
Figure 5-1. Single PLL Power Supply Filter Circuit with A1VDD Pin and A2VDD Pin Tied to GND ......... 51
Figure 5-2. PLL Power Supply Filter Circuit with Two AVDD Pins and One Ferrite Bead ........................ 51
Figure 5-3. Dual PLL Power Supply Filter Circuits ................................................................................... 53
Figure 5-4. Orientation and Layout of the 750GL Decoupling Capacitors ................................................ 56
Figure 5-5. Driver Impedance Measurement ............................................................................................ 57
Figure 5-6. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector ........................ 62
Figure 5-7. Package Exploded Cross-Sectional View with Several Heat-Sink Options ........................... 63
Figure 5-8. C4 Package with Heat Sink Mounted to a Printed-Circuit Board ........................................... 66
Figure 5-9. Thermal Performance of Select Thermal Interface Material .................................................. 67
Figure 5-10. Example of a Pin-Fin Heat-Sink-to-Ambient Thermal Resistance versus Airflow Velocity .... 69
750GL_dsLOF.fm.1.2
March 13, 2006
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